28-C300-00

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	28-C300-00

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	28
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Features	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Post	Contact Material - Mating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Mounting Type	Termination	Material Flammability Rating	Housing Material	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post
Aries Electronics 28-C300-00	10 çin	0.25 çm	105 ░C	-55 °C	Closed Frame	Gold	28	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Beryllium Copper	3 A	0.04 in	1.02 mm	Surface Mount	Solder	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 28-C300-30	10 çin	0.25 çm	105 ░C	-55 °C	Closed Frame	Gold	28	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Beryllium Copper	3 A	0.04 in	1.02 mm	Through Hole	Wire Wrap	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 28-C300-21	10 çin	0.25 çm	125 °C	-55 °C	Closed Frame	Gold	28	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Beryllium Copper	3 A	0.04 in	1.02 mm	Through Hole	Wire Wrap	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	37	$ 12.86

General part information

28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount

Technical documentation and resources