28-C300 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Features	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Post	Contact Material - Mating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Mounting Type	Termination	Material Flammability Rating	Housing Material	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post
Aries Electronics 28-C300-00	10 çin	0.25 çm	105 ░C	-55 °C	Closed Frame	Gold	28	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Beryllium Copper	3 A	0.04 in	1.02 mm	Surface Mount	Solder	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 28-C300-30	10 çin	0.25 çm	105 ░C	-55 °C	Closed Frame	Gold	28	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Tin	Beryllium Copper	3 A	0.04 in	1.02 mm	Through Hole	Wire Wrap	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in
Aries Electronics 28-C300-21	10 çin	0.25 çm	125 °C	-55 °C	Closed Frame	Gold	28	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Gold	Beryllium Copper	3 A	0.04 in	1.02 mm	Through Hole	Wire Wrap	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	0.1 in	2.54 mm	2.54 mm	0.1 in