81-02-11818-2000

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

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Parker Chomerics

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics commom to parts in this series

RFI FINGERSTOCK BECU UNPLAT ADH

Part	Width [x]	Width	Material	Height [z]	Height [z]	Attachment Method	Operating Temperature [Min]	Operating Temperature [Max]	Plating	Type	Length [x]	Length [x]	Width [y]	Width [y]	Width	Width [x]
Parker Chomerics 81-02-14306-2000	0.37 in	9.4 mm	Beryllium Copper	0.131 in	3.33 mm	Adhesive	-40 °C	121 °C	Unplated	Fingerstock	15.984 "	406 mm
Parker Chomerics 81-02-14274-2000			Beryllium Copper			Adhesive	-40 °C	121 °C	Unplated	Fingerstock	15.984 "	406 mm	0.45 in	11.43 mm
Parker Chomerics 81-02-14308-2000		15.24 mm	Beryllium Copper	0.22 in	5.59 mm	Adhesive	-40 °C	121 °C	Unplated	Fingerstock	17.992 in	457 mm			0.6 in
Parker Chomerics 81-02-11818-2000	0.228 "		Beryllium Copper	0.03 in	0.76 mm	Adhesive	-40 °C	121 °C	Unplated	Fingerstock	15.984 "	406 mm				5.8 mm
Parker Chomerics 81-02-14449-2000			Beryllium Copper	0.12 "	3.05 mm	Adhesive	-40 °C	121 °C	Unplated	Fingerstock	15.984 "	406 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly