HTSS-108-01-S-DV

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Samtec Inc.

CONN HEADER SMD 16POS 2.54MM

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HTSS-108-01-S-DV

Active

Samtec Inc.

CONN HEADER SMD 16POS 2.54MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HTSS-108-01-S-DV

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Length - Mating	6.35 mm
Contact Length - Mating	0.25 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Features	Keying Slot
Insulation Color	Natural
Insulation Height [custom]	0.35 in
Insulation Height [custom]	8.89 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder

HTSS-108 Series

Part	Contact Length - Post	Contact Length - Post	Number of Rows	Shrouding	Mounting Type	Overall Contact Length	Overall Contact Length	Contact Finish - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Material	Connector Type	Insulation Material	Fastening Type	Contact Shape	Termination	Pitch - Mating	Pitch - Mating	Style	Material Flammability Rating	Features	Number of Positions Loaded	Operating Temperature [Min]	Operating Temperature [Max]	Contact Type	Number of Positions	Contact Length - Mating	Contact Length - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height [custom]	Insulation Height [custom]	Contact Finish - Post	Insulation Color	Number of Positions Loaded	Insulation Height	Insulation Height	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. HTSS-108-01-F-D-01	2.92 mm	0.115 in	2	Shrouded - 4 Wall	Through Hole	0.48 in	12.19 mm	Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot	15	-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	3 µin	0.076 µm	0.35 in	8.89 mm	Tin	Natural
Samtec Inc. HTSS-108-04-S-D-RA	3.3 mm	0.13 in	2	Shrouded - 4 Wall	Through Hole Right Angle			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	30 Áin	0.76 Ám			Tin	Natural	All	0.365 in	9.27 mm
Samtec Inc. HTSS-108-01-S-D-EM			2	Shrouded - 4 Wall	Board Edge Straddle Mount			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	30 Áin	0.76 Ám			Tin	Natural	All
Samtec Inc. HTSS-108-04-F-D-RA	3.3 mm	0.13 in	2	Shrouded - 4 Wall	Through Hole Right Angle			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	3 µin	0.076 µm			Tin	Natural	All	0.365 in	9.27 mm
Samtec Inc. HTSS-108-01-S-DV			2	Shrouded - 4 Wall	Surface Mount			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	30 Áin	0.76 Ám	0.35 in	8.89 mm	Tin	Natural	All
Samtec Inc. HTSS-108-01-L-DV-P			2	Shrouded - 4 Wall	Surface Mount			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot Pick and Place		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	10 çin	0.25 çm	0.35 in	8.89 mm	Tin	Natural	All
Samtec Inc. HTSS-108-01-H-D	2.92 mm	0.115 in	2	Shrouded - 4 Wall	Through Hole	0.48 in	12.19 mm	Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	30 Áin	0.76 Ám	0.35 in	8.89 mm	Gold	Natural	All			3 µin	0.076 µm
Samtec Inc. HTSS-108-01-SM-DV			2	Shrouded - 4 Wall	Surface Mount			Gold	2.54 mm	0.1 in	Phosphor Bronze	Header	Liquid Crystal Polymer (LCP)	Push-Pull	Square	Solder	0.1 in	2.54 mm	Board to Board Cable	UL94 V-0	Keying Slot		-55 °C	125 °C	Male Pin	16	6.35 mm	0.25 in	30 Áin	0.76 Ám	0.35 in	8.89 mm	Tin	Natural	All
Samtec Inc. HTSS-108-03-L-D
Samtec Inc. HTSS-108-01-T-D

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	23	$ 4.41

Description

General part information

HTSS-108 Series

Connector Header Surface Mount 16 position 0.100" (2.54mm)

Documents

Technical documentation and resources

No documents available