T2M-106-01-L-D-TH

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Samtec Inc.

PLUGIN WIRE TO BOARD CONNECTOR ROHS

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T2M-106-01-L-D-TH

Active

Samtec Inc.

PLUGIN WIRE TO BOARD CONNECTOR ROHS

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	T2M-106-01-L-D-TH

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Length - Post	0.117 in
Contact Length - Post	2.97 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3.8 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	5.8 mm
Insulation Height	0.228 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	12
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	0.302 in
Overall Contact Length	7.67 mm
Pitch - Mating [x]	0.079 in
Pitch - Mating [x]	2 mm
Row Spacing - Mating	0.079 in
Row Spacing - Mating	2 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder

T2M-106 Series

Part	Termination	Number of Positions Loaded	Contact Type	Contact Length - Post	Contact Length - Post	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish - Mating	Style	Insulation Height	Insulation Height	Insulation Material	Connector Type	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Overall Contact Length	Overall Contact Length	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions	Contact Material	Insulation Color	Number of Rows	Contact Finish - Post	Fastening Type	Shrouding	Current Rating (Amps)	Features	Insulation Height [z]	Insulation Height [z]
Samtec Inc. T2M-106-01-L-D-TH-DS	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange
Samtec Inc. T2M-106-01-L-D-TH	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A
Samtec Inc. T2M-106-01-S-D-SM-WT	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention
Samtec Inc. T2M-106-01-S-D-RA-WT	Solder	All	Male Pin	0.09 "	2.29 mm	0.079 in	2 mm	Gold	Board to Board Cable			Liquid Crystal Polymer (LCP)	Header	Through Hole Right Angle	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention	7.44 mm	0.293 in
Samtec Inc. T2M-106-01-L-D-TH-WT	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention
Samtec Inc. T2M-106-01-L-D-SM-WT-K	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Pick and Place Solder Retention
Samtec Inc. T2M-106-01-S-D-RA	Solder	All	Male Pin	0.09 "	2.29 mm	0.079 in	2 mm	Gold	Board to Board Cable			Liquid Crystal Polymer (LCP)	Header	Through Hole Right Angle	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A		7.44 mm	0.293 in
Samtec Inc. T2M-106-01-L-D-SM-WT-K-TR	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Pick and Place Solder Retention
Samtec Inc. T2M-106-01-L-D-SM-DS	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange
Samtec Inc. T2M-106-01-S-D-SM-DS	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 3.83
LCSC	Piece	1	$ 9.58
		192	$ 3.82
		512	$ 3.70
		992	$ 3.63

Description

General part information

T2M-106 Series

Connector Header Through Hole 12 position 0.079" (2.00mm)

Documents

Technical documentation and resources

No documents available