T2M-106 Series

Catalog

CONN HEADER VERT 12POS 2MM

Part	Current Rating	Contact Material	Contact Shape	Termination	Contact Finish Thickness - Mating	Overall Contact Length	Contact Finish - Mating	Mounting Type	Fastening Type	Features	Row Spacing - Mating	Pitch - Mating	Shrouding	Style	Connector Type	Number of Positions Loaded	Contact Type	Insulation Height	Insulation Material	Insulation Color	Number of Rows	Contact Length - Post	Contact Finish - Post	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)
Samtec Inc. T2M-106-01-L-D-TH-DS	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	10 µin	0.302 in	Gold	Through Hole	Push-Pull	Mating Flange	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2	0.117 in	Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-L-D-SM-DS-TR	3.8 A	Phosphor Bronze	Square	Solder	10 µin		Gold	Surface Mount	Push-Pull	Mating Flange	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2		Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-L-D-TH	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	10 µin	0.302 in	Gold	Through Hole	Push-Pull		0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2	0.117 in	Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-S-D-SM-WT	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	30 µin		Gold	Surface Mount	Push-Pull	Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2		Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-S-D-SM-WT-K-TR	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	30 µin		Gold	Surface Mount	Push-Pull	Pick and Place Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2		Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-S-D-RA-WT	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	30 µin		Gold	Right Angle Through Hole	Push-Pull	Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.293 in	Liquid Crystal Polymer (LCP)	Black	2	0.09 in	Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-L-D-TH-WT	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	10 µin	0.302 in	Gold	Through Hole	Push-Pull	Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2	0.117 in	Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-S-D-TH-WT	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	30 µin	0.302 in	Gold	Through Hole	Push-Pull	Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2	0.117 in	Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-L-D-SM-WT-K	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	10 µin		Gold	Surface Mount	Push-Pull	Pick and Place Solder Retention	0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.228 in	Liquid Crystal Polymer (LCP)	Black	2		Tin	12	125 °C	-55 °C
Samtec Inc. T2M-106-01-S-D-RA	2.6 A 3.8 A	Phosphor Bronze	Square	Solder	30 µin		Gold	Right Angle Through Hole	Push-Pull		0.079 in	0.079 in	Shrouded - 4 Wall	Board Board or Cable	Header	All	Male Pin	0.293 in	Liquid Crystal Polymer (LCP)	Black	2	0.09 in	Tin	12	125 °C	-55 °C