T2M-106 Series

Catalog

CONN HEADER VERT 12POS 2MM

Part	Termination	Number of Positions Loaded	Contact Type	Contact Length - Post	Contact Length - Post	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish - Mating	Style	Insulation Height	Insulation Height	Insulation Material	Connector Type	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Overall Contact Length	Overall Contact Length	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions	Contact Material	Insulation Color	Number of Rows	Contact Finish - Post	Fastening Type	Shrouding	Current Rating (Amps)	Features	Insulation Height [z]	Insulation Height [z]
Samtec Inc. T2M-106-01-L-D-TH-DS	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange
Samtec Inc. T2M-106-01-L-D-TH	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A
Samtec Inc. T2M-106-01-S-D-SM-WT	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention
Samtec Inc. T2M-106-01-S-D-RA-WT	Solder	All	Male Pin	0.09 "	2.29 mm	0.079 in	2 mm	Gold	Board to Board Cable			Liquid Crystal Polymer (LCP)	Header	Through Hole Right Angle	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention	7.44 mm	0.293 in
Samtec Inc. T2M-106-01-L-D-TH-WT	Solder	All	Male Pin	0.117 in	2.97 mm	0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Through Hole	-55 °C	125 °C	0.302 in	7.67 mm	Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Solder Retention
Samtec Inc. T2M-106-01-L-D-SM-WT-K	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Pick and Place Solder Retention
Samtec Inc. T2M-106-01-S-D-RA	Solder	All	Male Pin	0.09 "	2.29 mm	0.079 in	2 mm	Gold	Board to Board Cable			Liquid Crystal Polymer (LCP)	Header	Through Hole Right Angle	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A		7.44 mm	0.293 in
Samtec Inc. T2M-106-01-L-D-SM-WT-K-TR	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Pick and Place Solder Retention
Samtec Inc. T2M-106-01-L-D-SM-DS	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	10 çin	0.25 çm	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange
Samtec Inc. T2M-106-01-S-D-SM-DS	Solder	All	Male Pin			0.079 in	2 mm	Gold	Board to Board Cable	5.8 mm	0.228 in	Liquid Crystal Polymer (LCP)	Header	Surface Mount	-55 °C	125 °C			Square	0.079 in	2 mm	30 Áin	0.76 Ám	12	Phosphor Bronze	Black	2	Tin	Push-Pull	Shrouded - 4 Wall	3.8 A	Mating Flange