HSEC8-1100-03-S-DV-A-WT-K

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Samtec Inc.

CONN EDGE DUAL FML 200POS 0.031

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HSEC8-1100-03-S-DV-A-WT-K

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Samtec Inc.

CONN EDGE DUAL FML 200POS 0.031

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HSEC8-1100-03-S-DV-A-WT-K

Card Thickness	0.093 in
Card Thickness	2.36 mm
Card Type	Non Specified - Dual Edge
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.76 Ám
Contact Finish Thickness	30 Áin
Contact Material	Beryllium Copper
Contact Type	Cantilever
Features	Solder Retention, Board Guide
Gender	Female
Material - Insulation	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions/Bay/Row [custom]	100
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch [x]	0.8 mm
Pitch [x]	0.031 in
Read Out	Dual
Termination	Solder

HSEC8-1100 Series

Part	Card Type	Material - Insulation	Mounting Type	Gender	Termination	Contact Finish	Operating Temperature [Min]	Operating Temperature [Max]	Card Thickness	Card Thickness	Read Out	Contact Material	Contact Finish Thickness	Contact Finish Thickness	Number of Rows	Contact Type	Color	Number of Positions/Bay/Row [custom]	Features	Pitch [x]	Pitch [x]
Samtec Inc. HSEC8-1100-01-L-DV-A-WT	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	10 Áin	0.25 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-S-DV-A-BL-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide Board Lock	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-03-S-DV-A-WT-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.093 in	2.36 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-H-DV-A	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-H-DV-BL	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100		0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-L-DV-A-WT-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	10 Áin	0.25 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	26	$ 13.11

Description

General part information

HSEC8-1100 Series

200 Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black

Documents

Technical documentation and resources