HSEC8-1100 Series

Catalog

CONN EDGE DUAL FML 200POS 0.031

Part	Card Type	Material - Insulation	Mounting Type	Gender	Termination	Contact Finish	Operating Temperature [Min]	Operating Temperature [Max]	Card Thickness	Card Thickness	Read Out	Contact Material	Contact Finish Thickness	Contact Finish Thickness	Number of Rows	Contact Type	Color	Number of Positions/Bay/Row [custom]	Features	Pitch [x]	Pitch [x]
Samtec Inc. HSEC8-1100-01-L-DV-A-WT	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	10 Áin	0.25 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-S-DV-A-BL-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide Board Lock	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-03-S-DV-A-WT-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.093 in	2.36 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-H-DV-A	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100	Board Guide	0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-H-DV-BL	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	30 Áin	0.76 Ám	2	Cantilever	Black	100		0.8 mm	0.031 in
Samtec Inc. HSEC8-1100-01-L-DV-A-WT-K	Non Specified - Dual Edge	Liquid Crystal Polymer (LCP)	Surface Mount	Female	Solder	Gold	-55 °C	125 °C	0.062 in	1.57 mm	Dual	Beryllium Copper	10 Áin	0.25 Ám	2	Cantilever	Black	100	Board Guide Solder Retention	0.8 mm	0.031 in