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22-3513-11

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Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

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22-3513-11

Active
Aries Electronics

CONN IC DIP SOCKET 22POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification22-3513-11
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)22
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
Type0.3 "
Type7.62 mm
TypeDIP

22-3513 Series

PartPitch - MatingPitch - MatingTermination Post LengthTermination Post LengthContact Material - Post [custom]FeaturesHousing MaterialContact Material - MatingContact Finish - PostNumber of Positions or Pins (Grid)Current Rating (Amps)TypeTypeTypeOperating Temperature [Max]Operating Temperature [Min]Contact Finish Thickness - PostContact Finish Thickness - PostMaterial Flammability RatingTerminationPitch - PostPitch - PostContact Finish - MatingMounting TypeContact Finish Thickness - MatingContact Finish Thickness - Mating
Aries Electronics
0.1 in
2.54 mm
3.18 mm
0.125 in
Brass
Closed Frame
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
Gold
22
3 A
0.3 "
7.62 mm
DIP
105 ░C
-55 °C
10 çin
0.25 çm
UL94 V-0
Solder
2.54 mm
0.1 in
Gold
Through Hole
10 çin
0.25 çm
Aries Electronics
0.1 in
2.54 mm
3.18 mm
0.125 in
Brass
Closed Frame
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
Gold
22
3 A
0.3 "
7.62 mm
DIP
105 ░C
-55 °C
10 çin
0.25 çm
UL94 V-0
Solder
2.54 mm
0.1 in
Gold
Through Hole
10 çin
0.25 çm
Aries Electronics
0.1 in
2.54 mm
3.18 mm
0.125 in
Brass
Closed Frame
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
Tin
22
3 A
0.3 "
7.62 mm
DIP
105 ░C
-55 °C
200 µin
5.08 µm
UL94 V-0
Solder
2.54 mm
0.1 in
Gold
Through Hole
10 çin
0.25 çm
Aries Electronics
0.1 in
2.54 mm
3.18 mm
0.125 in
Brass
Closed Frame
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
Tin
22
3 A
0.3 "
7.62 mm
DIP
105 ░C
-55 °C
200 µin
5.08 µm
UL94 V-0
Solder
2.54 mm
0.1 in
Gold
Through Hole
10 çin
0.25 çm
Aries Electronics
0.1 in
2.54 mm
3.18 mm
0.125 in
Brass
Closed Frame
Glass Filled
Nylon 4/6
Polyamide (PA46)
Beryllium Copper
Tin
22
3 A
0.3 "
7.62 mm
DIP
105 ░C
-55 °C
200 µin
5.08 µm
UL94 V-0
Solder
2.54 mm
0.1 in
Gold
Through Hole
10 çin
0.25 çm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 105$ 4.85

Description

General part information

22-3513 Series

22 (2 x 11) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources