22-3513 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Features	Housing Material	Contact Material - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Current Rating (Amps)	Type	Type	Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Termination	Pitch - Post	Pitch - Post	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 22-3513-11	0.1 in	2.54 mm	3.18 mm	0.125 in	Brass	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	Gold	22	3 A	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	10 çin	0.25 çm	UL94 V-0	Solder	2.54 mm	0.1 in	Gold	Through Hole	10 çin	0.25 çm
Aries Electronics 22-3513-11H	0.1 in	2.54 mm	3.18 mm	0.125 in	Brass	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	Gold	22	3 A	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	10 çin	0.25 çm	UL94 V-0	Solder	2.54 mm	0.1 in	Gold	Through Hole	10 çin	0.25 çm
Aries Electronics 22-3513-10H	0.1 in	2.54 mm	3.18 mm	0.125 in	Brass	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	Tin	22	3 A	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	200 µin	5.08 µm	UL94 V-0	Solder	2.54 mm	0.1 in	Gold	Through Hole	10 çin	0.25 çm
Aries Electronics 22-3513-10	0.1 in	2.54 mm	3.18 mm	0.125 in	Brass	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	Tin	22	3 A	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	200 µin	5.08 µm	UL94 V-0	Solder	2.54 mm	0.1 in	Gold	Through Hole	10 çin	0.25 çm
Aries Electronics 22-3513-10T	0.1 in	2.54 mm	3.18 mm	0.125 in	Brass	Closed Frame	Glass Filled Nylon 4/6 Polyamide (PA46)	Beryllium Copper	Tin	22	3 A	0.3 "	7.62 mm	DIP	105 ░C	-55 °C	200 µin	5.08 µm	UL94 V-0	Solder	2.54 mm	0.1 in	Gold	Through Hole	10 çin	0.25 çm