HMTSW-113-24-LM-D-263

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 26 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

HMTSW-113-24-LM-D-263

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 26 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Description Specifications Series Pricing CAD Documents

Description

General part information

HMTSW-113 Series

Connector Header Through Hole 26 position 0.100" (2.54mm)

Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-113-24-LM-D-263

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Mating	0.263 in
Contact Length - Post	0.117 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	26
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Overall Contact Length	0.48 in
Pitch - Mating	0.1 in
Row Spacing - Mating	0.1 in
Shrouding	Unshrouded
Style	Board, Board or Cable
Termination	Solder

HMTSW-113 Series

Part	Contact Finish Thickness - Mating	Contact Finish - Post	Current Rating	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Overall Contact Length	Insulation Material	Style	Insulation Height	Contact Length - Mating	Mounting Type	Contact Finish - Mating	Pitch - Mating	Contact Shape	Contact Type	Connector Type	Shrouding	Fastening Type	Contact Material	Row Spacing - Mating	Material Flammability Rating	Termination	Number of Rows	Number of Positions Loaded	Insulation Color	Contact Length - Post	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. HMTSW-113-10-S-D-645	30 µin	Tin	3 A	26	125 °C	-55 °C	0.83 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.645 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.085 in
Samtec Inc. HMTSW-113-08-S-D-340	30 µin	Tin	3 A	26	125 °C	-55 °C	0.53 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.34 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.09 in
Samtec Inc. HMTSW-113-10-L-D-645	10 µin	Tin	3 A	26	125 °C	-55 °C	0.83 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.645 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.085 in
Samtec Inc. HMTSW-113-08-H-D-340	30 µin	Gold	3 A	26	125 °C	-55 °C	0.53 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.34 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.09 in	3 µin
Samtec Inc. HMTSW-113-07-T-S-090-RA		Tin	3 A	13	105 °C	-55 °C		Liquid Crystal Polymer (LCP)	Board Board or Cable	0.122 in	0.09 in	Right Angle Through Hole	Tin	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze		UL94 V-0	Solder	1	All	Natural
Samtec Inc. HMTSW-113-11-L-D-480	10 µin	Tin	3 A	26	125 °C	-55 °C	0.93 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.48 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.35 in
Samtec Inc. HMTSW-113-07-LM-D-210-024	10 µin	Tin	3 A	26	125 °C	-55 °C	0.43 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.21 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2		Natural	0.12 in		25
Samtec Inc. HMTSW-113-08-G-T-200-RA	10 µin	Gold	3 A	39	125 °C	-55 °C		Liquid Crystal Polymer (LCP)	Board Board or Cable	0.319 in	0.2 in	Right Angle Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	3	All	Natural		3 µin
Samtec Inc. HMTSW-113-24-LM-D-263	10 µin	Tin	3 A	26	125 °C	-55 °C	0.48 in	Liquid Crystal Polymer (LCP)	Board Board or Cable	0.1 in	0.263 in	Through Hole	Gold	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze	0.1 in	UL94 V-0	Solder	2	All	Natural	0.117 in
Samtec Inc. HMTSW-113-22-T-S-310-RA		Tin	3 A	13	105 °C	-55 °C		Liquid Crystal Polymer (LCP)	Board Board or Cable	0.122 in	0.31 in	Right Angle Through Hole	Tin	0.1 in	Square	Male Pin	Header	Unshrouded	Push-Pull	Phosphor Bronze		UL94 V-0	Solder	1	All	Natural

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

HMTSW-113-24-LM-D-263 | Datasheet

Datasheet