HMTSW-113-08-G-T-200-RA

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Samtec Inc.

CONN HEADER R/A 39POS 2.54MM

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HMTSW-113-08-G-T-200-RA

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Samtec Inc.

CONN HEADER R/A 39POS 2.54MM

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Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-113-08-G-T-200-RA

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating [x]	5.08 mm
Contact Length - Mating [x]	0.2 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	8.1 mm
Insulation Height	0.319 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	39
Number of Positions Loaded	All
Number of Rows	3
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-113 Series

Part	Contact Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating	Contact Length - Mating	Insulation Material	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Termination	Fastening Type	Contact Shape	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Number of Rows	Number of Positions	Style	Number of Positions Loaded	Current Rating (Amps)	Insulation Height	Insulation Height	Pitch - Mating	Pitch - Mating	Contact Length - Post	Contact Length - Post	Mounting Type	Connector Type	Contact Finish - Post	Insulation Color	Overall Contact Length	Overall Contact Length	Contact Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]	Number of Positions Loaded	Contact Length - Mating [x]	Contact Length - Mating [x]
Samtec Inc. HMTSW-113-10-L-D-645	Male Pin	UL94 V-0	10 çin	0.25 çm	0.645 in	16.38 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable	All	3 A	0.1 in	2.54 mm	0.1 in	2.54 mm	2.16 mm	0.085 in	Through Hole	Header	Tin	Natural	0.83 in	21.08 mm	Phosphor Bronze
Samtec Inc. HMTSW-113-08-H-D-340	Male Pin	UL94 V-0	30 Áin	0.76 Ám	0.34 in	8.64 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable	All	3 A	0.1 in	2.54 mm	0.1 in	2.54 mm	2.29 mm	0.09 "	Through Hole	Header	Gold	Natural	0.53 in	13.46 mm	Phosphor Bronze	3 µin	0.076 µm
Samtec Inc. HMTSW-113-07-T-S-090-RA	Male Pin	UL94 V-0			0.09 in	2.29 mm	Liquid Crystal Polymer (LCP)			Solder	Push-Pull	Square		-55 °C	105 ░C	Unshrouded	1	13	Board to Board Cable	All	3 A	0.122 in	3.1 mm	0.1 in	2.54 mm			Through Hole Right Angle	Header	Tin	Natural			Phosphor Bronze
Samtec Inc. HMTSW-113-07-LM-D-210-024	Male Pin	UL94 V-0	10 çin	0.25 çm	0.21 in	5.33 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable		3 A	0.1 in	2.54 mm	0.1 in	2.54 mm			Through Hole	Header	Tin	Natural	0.43 in	10.92 mm	Phosphor Bronze			0.12 in	3.05 mm	25
Samtec Inc. HMTSW-113-08-G-T-200-RA	Male Pin	UL94 V-0	10 çin	0.25 çm			Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	3	39	Board to Board Cable	All	3 A	0.319 in	8.1 mm	0.1 in	2.54 mm			Through Hole Right Angle	Header	Gold	Natural			Phosphor Bronze	3 µin	0.076 µm				5.08 mm	0.2 in
Samtec Inc. HMTSW-113-22-LM-D-320-RA-04	Male Pin	UL94 V-0	10 çin	0.25 çm	0.32 in	8.13 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable		3 A	0.24 in	6.1 mm	0.1 in	2.54 mm			Through Hole Right Angle	Header	Tin	Natural			Phosphor Bronze					25
Samtec Inc. HMTSW-113-24-LM-D-263	Male Pin	UL94 V-0	10 çin	0.25 çm	0.263 in	6.68 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable	All	3 A	0.1 in	2.54 mm	0.1 in	2.54 mm	2.97 mm	0.117 in	Through Hole	Header	Tin	Natural	0.48 in	12.19 mm	Phosphor Bronze
Samtec Inc. HMTSW-113-22-T-S-310-RA	Male Pin	UL94 V-0			0.31 in	7.87 mm	Liquid Crystal Polymer (LCP)			Solder	Push-Pull	Square		-55 °C	105 ░C	Unshrouded	1	13	Board to Board Cable	All	3 A	0.122 in	3.1 mm	0.1 in	2.54 mm			Through Hole Right Angle	Header	Tin	Natural			Phosphor Bronze
Samtec Inc. HMTSW-113-08-G-D-318	Male Pin	UL94 V-0	10 çin	0.25 çm			Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable	All	3 A	0.1 in	2.54 mm	0.1 in	2.54 mm	2.84 mm	0.112 in	Through Hole	Header	Gold	Natural	0.53 in	13.46 mm	Phosphor Bronze	3 µin	0.076 µm				8.08 mm	0.318 "
Samtec Inc. HMTSW-113-08-G-D-235	Male Pin	UL94 V-0	10 çin	0.25 çm		5.97 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Solder	Push-Pull	Square	Gold	-55 °C	125 °C	Unshrouded	2	26	Board to Board Cable	All	3 A	0.1 in	2.54 mm	0.1 in	2.54 mm	4.95 mm	0.195 in	Through Hole	Header	Gold	Natural	0.53 in	13.46 mm	Phosphor Bronze	3 µin	0.076 µm					0.235 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 6.01

Description

General part information

HMTSW-113 Series

Connector Header Through Hole, Right Angle 39 position 0.100" (2.54mm)

Documents

Technical documentation and resources