TS991AX500T4

Active

Chip Quik Inc.

SOLDER PASTE THERMALLY STABLE NC

Search across all available documentation for this part.

Active

Chip Quik Inc.

SOLDER PASTE THERMALLY STABLE NC

Technical Specifications

Parameters and characteristics for this part

SOLDER PASTE THERMALLY STABLE NC

Part	Form	Form	Process	Flux Type	Shelf Life Start	Mesh Type [custom]	Melting Point [custom]	Melting Point [custom]	Type	Shelf Life
Chip Quik Inc. TS991AX500T4	Jar	17.64 oz, 500 g	Leaded	No-Clean	Date of Manufacture	4	361 °F	183 °C	Solder Paste	12 Months

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 105.77

General part information

Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 17.64 oz (500g)

Technical documentation and resources