SOLDER PASTE THERMALLY STABLE NC
| Part | Form | Form | Process | Flux Type | Shelf Life Start | Mesh Type [custom] | Melting Point [custom] | Melting Point [custom] | Type | Shelf Life |
|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. TS991AX500T4 | Jar | 17.64 oz, 500 g | Leaded | No-Clean | Date of Manufacture | 4 | 361 °F | 183 °C | Solder Paste | 12 Months |