Specification	ESQT-111-02-L-Q-755

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Length - Post	0.095 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Forked
Current Rating (Per Contact)	4.5 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.755 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	44
Number of Positions Loaded	All
Number of Rows	4
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Style	Board, Board or Cable
Termination	Solder

ESQT-111 Series

Part	Number of Positions	Material Flammability Rating	Operating Temperature (Max)	Operating Temperature (Min)	Row Spacing - Mating	Number of Rows	Pitch - Mating	Mounting Type	Current Rating (Per Contact)	Insulation Color	Termination	Number of Positions Loaded	Style	Contact Finish Thickness - Mating	Fastening Type	Contact Finish - Mating	Contact Type	Connector Type	Contact Length - Post	Insulation Height	Contact Finish - Post	Contact Material	Insulation Material	Contact Shape	Contact Finish Thickness - Post	Number of Positions Loaded
Samtec Inc. ESQT-111-02-F-D-380	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	3 µin	Push-Pull	Gold	Forked	Elevated Socket	0.47 in	0.38 in	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQT-111-02-G-D-500	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.35 in	0.5 in	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	3 µin
Samtec Inc. ESQT-111-03-LM-S-330	11	UL94 V-0	125 °C	-55 °C		1	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	10 µin	Push-Pull	Gold	Forked	Elevated Socket	0.128 in	0.33 in	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQT-111-03-G-D-368	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.09 in	0.368 in	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	3 µin
Samtec Inc. ESQT-111-02-G-D-400	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.45 in	0.4 in	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	3 µin
Samtec Inc. ESQT-111-03-F-D-310	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	3 µin	Push-Pull	Gold	Forked	Elevated Socket	0.148 in	0.31 in	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQT-111-02-M-D-310	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.54 in	0.31 in	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQT-111-03-G-D-370	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.088 in	0.37 in	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	3 µin
Samtec Inc. ESQT-111-02-L-D-710	22	UL94 V-0	125 °C	-55 °C	0.079 in	2	0.079 in	Through Hole	4.5 A	Black	Solder	All	Board Board or Cable	10 µin	Push-Pull	Gold	Forked	Elevated Socket	0.14 in	0.71 in	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square
Samtec Inc. ESQT-111-02-G-S-310-001	11	UL94 V-0	125 °C	-55 °C		1	0.079 in	Through Hole	4.5 A	Black	Solder		Board Board or Cable	20 Ąin	Push-Pull	Gold	Forked	Elevated Socket	0.54 in	0.31 in	Gold	Phosphor Bronze	Liquid Crystal Polymer (LCP)	Square	3 µin	10

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