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ESQT-111-03-G-D-370

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Samtec Inc.

CONN SOCKET 22POS 0.079 GOLD PCB

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ESQT-111-03-G-D-370

Active
Samtec Inc.

CONN SOCKET 22POS 0.079 GOLD PCB

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationESQT-111-03-G-D-370
Connector TypeElevated Socket
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.51 µm
Contact Finish Thickness - Mating20 µin
Contact Finish Thickness - Post3 µin
Contact Finish Thickness - Post0.076 µm
Contact Length - Post [x]2.23 mm
Contact Length - Post [x]0.088 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeForked
Current Rating (Amps)4.5 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.37 in
Insulation Height9.4 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions22 positions
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating [x]0.079 in
Pitch - Mating [x]2 mm
Row Spacing - Mating0.079 in
Row Spacing - Mating2 mm
StyleBoard to Board, Cable
TerminationSolder

ESQT-111 Series

PartContact Finish Thickness - PostContact Finish Thickness - PostCurrent Rating (Amps)Contact MaterialContact TypeContact Length - Post [x]Contact Length - Post [x]Row Spacing - MatingRow Spacing - MatingFastening TypeContact ShapeOperating Temperature [Min]Operating Temperature [Max]Number of RowsInsulation ColorInsulation MaterialContact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish - MatingContact Finish - PostStyleInsulation HeightInsulation HeightMounting TypeConnector TypeNumber of PositionsPitch - Mating [x]Pitch - Mating [x]Material Flammability RatingNumber of Positions LoadedTerminationContact Length - PostContact Length - Post
3 µin
0.076 µm
4.5 A
Phosphor Bronze
Forked
8.89 mm
0.35 in
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.51 µm
20 µin
Gold
Gold
Board to Board
Cable
0.5 in
12.7 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
4.5 A
Phosphor Bronze
Forked
Push-Pull
Square
-55 °C
125 °C
1
Black
Liquid Crystal Polymer (LCP)
0.25 çm
10 çin
Gold
Tin
Board to Board
Cable
0.33 in
8.38 mm
Through Hole
Elevated Socket
11
0.079 in
2 mm
UL94 V-0
All
Solder
0.128 "
3.25 mm
3 µin
0.076 µm
4.5 A
Phosphor Bronze
Forked
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.51 µm
20 µin
Gold
Gold
Board to Board
Cable
0.4 in
10.16 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
0.45 "
11.43 mm
4.5 A
Phosphor Bronze
Forked
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.076 µm
3 µin
Gold
Tin
Board to Board
Cable
0.31 in
7.87 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
0.148 in
3.76 mm
4.5 A
Phosphor Bronze
Forked
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.51 µm
20 µin
Gold
Tin
Board to Board
Cable
0.31 in
7.87 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
0.54 in
13.72 mm
3 µin
0.076 µm
4.5 A
Phosphor Bronze
Forked
12.07 mm
0.475 in
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
6
Black
Liquid Crystal Polymer (LCP)
0.51 µm
20 µin
Gold
Gold
Board to Board
Cable
0.375 in
9.53 mm
Through Hole
Elevated Socket
66
0.079 in
2 mm
UL94 V-0
All
Solder
3 µin
0.076 µm
4.5 A
Phosphor Bronze
Forked
2.23 mm
0.088 in
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.51 µm
20 µin
Gold
Gold
Board to Board
Cable
0.37 in
9.4 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
4.5 A
Phosphor Bronze
Forked
3.56 mm
0.14 in
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.25 çm
10 çin
Gold
Tin
Board to Board
Cable
0.71 "
18.03 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
4.5 A
Phosphor Bronze
Forked
5.08 mm
0.2 in
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.25 çm
10 çin
Gold
Tin
Board to Board
Cable
0.65 in
16.5 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
4.5 A
Phosphor Bronze
Forked
0.079 in
2 mm
Push-Pull
Square
-55 °C
125 °C
2
Black
Liquid Crystal Polymer (LCP)
0.25 çm
10 çin
Gold
Tin
Board to Board
Cable
0.77 in
19.56 mm
Through Hole
Elevated Socket
22 positions
0.079 in
2 mm
UL94 V-0
All
Solder
0.08 in
2.03 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 13.16

Description

General part information

ESQT-111 Series

22 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available