ESQT-111 Series
Manufacturer: Samtec Inc.
CONN SOCKET 22POS 0.079 GOLD PCB
| Part | Number of Positions | Material Flammability Rating | Operating Temperature (Max) | Operating Temperature (Min) | Row Spacing - Mating | Number of Rows | Pitch - Mating | Mounting Type | Current Rating (Per Contact) | Insulation Color | Termination | Number of Positions Loaded | Style | Contact Finish Thickness - Mating | Fastening Type | Contact Finish - Mating | Contact Type | Connector Type | Contact Length - Post | Insulation Height | Contact Finish - Post | Contact Material | Insulation Material | Contact Shape | Contact Finish Thickness - Post | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 3 µin | Push-Pull | Gold | Forked | Elevated Socket | 0.47 in | 0.38 in | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.35 in | 0.5 in | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | |
Samtec Inc. | 11 | UL94 V-0 | 125 °C | -55 °C | 1 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 10 µin | Push-Pull | Gold | Forked | Elevated Socket | 0.128 in | 0.33 in | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |||
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.09 in | 0.368 in | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | |
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.45 in | 0.4 in | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | |
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 3 µin | Push-Pull | Gold | Forked | Elevated Socket | 0.148 in | 0.31 in | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.54 in | 0.31 in | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.088 in | 0.37 in | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | |
Samtec Inc. | 22 | UL94 V-0 | 125 °C | -55 °C | 0.079 in | 2 | 0.079 in | Through Hole | 4.5 A | Black | Solder | All | Board Board or Cable | 10 µin | Push-Pull | Gold | Forked | Elevated Socket | 0.14 in | 0.71 in | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | 11 | UL94 V-0 | 125 °C | -55 °C | 1 | 0.079 in | Through Hole | 4.5 A | Black | Solder | Board Board or Cable | 20 Ąin | Push-Pull | Gold | Forked | Elevated Socket | 0.54 in | 0.31 in | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | 10 |