10108777-10110MLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 36POS 0.039

10108777-10110MLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 36POS 0.039

Description Specifications Series Pricing CAD Documents

Description

General part information

10108777 Series

36 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black

Technical Specifications

Parameters and characteristics for this part

Specification	10108777-10110MLF

Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Locking Ramp, Board Guide
Gender	Female
Material - Insulation	Nylon, Polyamide, PA, Glass Filled
Mounting Type	Through Hole
Number of Positions	36
Number of Rows	2
Pitch	0.039 in
Read Out	Dual
Termination	Staggered, Solder

10108777 Series

Part	Material - Insulation	Color	Read Out	Contact Type	Termination	Mounting Type	Card Thickness	Number of Positions	Contact Finish	Card Type	Contact Finish Thickness	Features	Contact Material	Pitch	Number of Rows	Gender	Contact Finish Thickness (string set options)	Contact Finish Thickness	Number of Bay	Operating Temperature (Min)	Operating Temperature (Max)	Termination Rows
Amphenol ICC (FCI) 10108777-10001MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10110MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	36	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10201MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	0	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female	Flash	Flash
Amphenol ICC (FCI) 10108777-10143ZLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	164	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10030RLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	11 36	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female			7	-55 °C	85 °C	2 rows
Amphenol ICC (FCI) 10108777-12102TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-11003TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	164	Gold	PCI Express™	30 µin	Board Lock Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10002MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-11112TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	15 µin	Board Lock Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10041TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

cardedge productpresentation Other Related Document

gs-12-233 Other Related Document

10108777-10110MLF | Datasheet