10108777 Series

Catalog

CONN PCI EXP FMALE 64POS 0.039

Part	Material - Insulation	Color	Read Out	Contact Type	Termination	Mounting Type	Card Thickness	Number of Positions	Contact Finish	Card Type	Contact Finish Thickness	Features	Contact Material	Pitch	Number of Rows	Gender	Contact Finish Thickness (string set options)	Contact Finish Thickness	Number of Bay	Operating Temperature (Min)	Operating Temperature (Max)	Termination Rows
Amphenol ICC (FCI) 10108777-10001MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10110MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	36	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10201MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	0	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female	Flash	Flash
Amphenol ICC (FCI) 10108777-10143ZLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	164	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10030RLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	11 36	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female			7	-55 °C	85 °C	2 rows
Amphenol ICC (FCI) 10108777-12102TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	15 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-11003TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	164	Gold	PCI Express™	30 µin	Board Lock Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10002MLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-11112TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	98	Gold	PCI Express™	15 µin	Board Lock Locking Ramp	Copper Alloy	0.039 in	2	Female
Amphenol ICC (FCI) 10108777-10041TLF	Glass Filled Nylon PA Polyamide	Black	Dual	Cantilever	Solder Staggered	Through Hole	0.062 in	64	Gold	PCI Express™	30 µin	Board Guide Locking Ramp	Copper Alloy	0.039 in	2	Female