10108777 Series

Catalog

CONN PCI EXP FMALE 64POS 0.039

Part	Termination	Features	Pitch [x]	Pitch [x]	Gender	Color	Mounting Type	Contact Finish Thickness	Contact Finish Thickness	Contact Finish	Card Type	Number of Rows	Contact Material	Number of Positions	Card Thickness	Card Thickness	Read Out	Contact Type	Material - Insulation	Contact Finish Thickness	Termination Rows	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions/Bay/Row
Amphenol ICC (FCI) 10108777-10001MLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.76 Ám	30 Áin	Gold	PCI Express™	2	Copper Alloy	64	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-10110MLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.38 µm	15 µin	Gold	PCI Express™	2	Copper Alloy	36	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-10201MLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole			Gold	PCI Express™	2	Copper Alloy	64	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)	Flash
Amphenol ICC (FCI) 10108777-10143ZLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.38 µm	15 µin	Gold	PCI Express™	2	Copper Alloy	164	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-10030RLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.76 Ám	30 Áin	Gold	PCI Express™	2	Copper Alloy	36	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)		2	85 °C	-55 °C	7 11
Amphenol ICC (FCI) 10108777-12102TLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.38 µm	15 µin	Gold	PCI Express™	2	Copper Alloy	98	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-10002MLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.76 Ám	30 Áin	Gold	PCI Express™	2	Copper Alloy	98	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-11112TLF	Solder Staggered	Board Lock Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.38 µm	15 µin	Gold	PCI Express™	2	Copper Alloy	98	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-10041TLF	Solder Staggered	Board Guide Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.76 Ám	30 Áin	Gold	PCI Express™	2	Copper Alloy	64	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)
Amphenol ICC (FCI) 10108777-11111TLF	Solder Staggered	Board Lock Locking Ramp	0.039 in	1 mm	Female	Black	Through Hole	0.38 µm	15 µin	Gold	PCI Express™	2	Copper Alloy	64	0.062 in	1.57 mm	Dual	Cantilever	Glass Filled Nylon Polyamide (PA)