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MSP430FR5847IDAR

MSP430FR5847IDAR

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Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 1KB SRAM, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR5847IDAR

MSP430FR5847IDAR

Active
Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 1KB SRAM, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR5847 Series

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices featuring FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, optimized to achieve extended battery life in energy-challenged applications.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5847IDAR
A/D Channels12 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O31
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package Length0.24 in
Package Name38-TSSOP
Package Width6.1 mm
PeripheralsPWM, POR, Reset, WDT, Brown-out Detect, DMA
Program Memory Depth32 K
Program Memory Size32 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth1 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
Smart Fault Indicator with MSP430 FRAM Microcontrollers
MSP430 MCUs Development Guide Book (Rev. A)
Benchmarking MCU power consumption for ultra-low-power applications
Industrial Communications Solutions Featuring MSP Microcontrollers
MSP430 FRAM Quality and Reliability (Rev. A)
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors
MSP-EXP430FR5969 Quick Start Guide (Rev. A)
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
MSP430FR5847 Microcontroller Errata (Rev. Z)
MSP430 System ESD Troubleshooting Guide
MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)
Enabling secure portable medical devices with TI’s MSP430™ MCU
FRAM FAQs
ESD Diode Current Specification (Rev. B)
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
System advantages of mixed signal integration
Capacitive Touch and MSP Microcontrollers (Rev. A)
MSP430FR5969 LaunchPad Development Kit (MSP-EXP430FR5969) User's Guide (Rev. B)
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
MSP Code Protection Features
MSP430 System-Level ESD Considerations (Rev. B)
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
MSP430FR586x, MSP430FR584x Mixed-Signal Microcontrollers datasheet (Rev. E)