10018784-10000MLF

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Amphenol ICC (FCI)

CONN PCI EXP FML 36POS 0.039

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10018784-10000MLF

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Amphenol ICC (FCI)

CONN PCI EXP FML 36POS 0.039

Deep-Dive with AI

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	2100	$ 0.64

Description

General part information

10018784 Series

36 Position Female Connector PCI Express™ Gold or Gold, GXT™ 0.039" (1.00mm) Black

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	10018784-10000MLF	10018784 Series

Card Thickness	0.062 in	0.062 - 0.093 in
Card Thickness	1.57 mm	1.57 - 2.36 mm
Card Type	PCI Express™	PCI Express™
Color	Black	Black, White
Contact Finish	GXT™, Gold or Gold	GXT™, Gold or Gold, Gold
Contact Finish Thickness	0.76 Ám	0.38 - 0.76 µm
Contact Finish Thickness	30 Áin	15 - 30 µin
Contact Finish Thickness	-	Flash
Contact Material	Copper Alloy	Copper Alloy
Contact Type	-	Cantilever
Features	Locking Ramp, Board Guide	Locking Ramp, Board Guide, Board Lock
Gender	Female	Female
Material - Insulation	Polyamide (PA), Glass Filled, Nylon	Polyamide (PA), Glass Filled, Nylon
Mounting Type	Through Hole	Through Hole
Number of Positions	36	36 - 164
Number of Positions/Bay/Row	-	21
Number of Positions/Bay/Row	-	11
Number of Rows	2	2
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch [x]	0.039 in	0.039 in
Pitch [x]	1 mm	1 mm
Read Out	Dual	Dual
Termination	Solder, Staggered	Solder, Staggered, Solder

10018784 Series

CONN PCI EXP FML 98POS 0.039

Part	Gender	Pitch [x]	Pitch [x]	Card Thickness	Card Thickness	Termination	Mounting Type	Contact Finish Thickness	Read Out	Color	Features	Contact Material	Operating Temperature [Max]	Operating Temperature [Min]	Material - Insulation	Number of Positions	Card Type	Number of Rows	Contact Finish	Contact Finish Thickness	Contact Finish Thickness	Contact Type	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10018784-10202MLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold or Gold, GXT™
Amphenol ICC (FCI) 10018784-00102TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	White	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold or Gold, GXT™	15 µin	0.38 µm
Amphenol ICC (FCI) 10018784-11103TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	Black	Board Lock, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	164	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever
Amphenol ICC (FCI) 10018784-10000MLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	36	PCI Express™	2	Gold or Gold, GXT™	30 Áin	0.76 Ám
Amphenol ICC (FCI) 10018784-00100TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	White	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	36	PCI Express™	2	Gold or Gold, GXT™	15 µin	0.38 µm
Amphenol ICC (FCI) 10018784-10213TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	164	PCI Express™	2	Gold			Cantilever
Amphenol ICC (FCI) 10018784-10201TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	64	PCI Express™	2	Gold			Cantilever	21	11
Amphenol ICC (FCI) 10018784-10112TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever
Amphenol ICC (FCI) 10018784-11201TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Lock, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	64	PCI Express™	2	Gold			Cantilever	21	11
Amphenol ICC (FCI) 10018784-10102TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever