CONN PCI EXP FMALE 36POS 0.039
| Part | Number of Positions | Termination | Pitch [x] | Pitch [x] | Number of Rows | Features | Card Thickness | Card Thickness | Contact Finish | Contact Type | Color | Mounting Type | Read Out | Card Type | Gender | Contact Finish Thickness | Contact Finish Thickness | Contact Material | Material - Insulation | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) 10018784-11010TLF | 36 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Lock, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | 0.76 Ám | 30 Áin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | |||
Amphenol ICC (FCI) 10018784-10112TLF | 98 | Solder | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | 0.38 µm | 15 µin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | |||
Amphenol ICC (FCI) 10018784-00201TLF | 64 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold or Gold, GXT™ | White | Through Hole | Dual | PCI Express™ | Female | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | Flash | |||||
Amphenol ICC (FCI) 10018784-10102TLF | 98 | Solder | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | 0.38 µm | 15 µin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | |||
Amphenol ICC (FCI) 10018784-11002TLF | 98 | Solder | 0.039 in | 1 mm | 2 | Board Lock, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | 0.76 Ám | 30 Áin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | |||
Amphenol ICC (FCI) 10018784-00103TLF | 164 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold or Gold, GXT™ | White | Through Hole | Dual | PCI Express™ | Female | 0.38 µm | 15 µin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | ||||
Amphenol ICC (FCI) 10018784-10210TLF | 36 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | Flash | ||||
Amphenol ICC (FCI) 10018784-11001TLF | 64 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Lock, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | 0.76 Ám | 30 Áin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | 21 | 11 | |
Amphenol ICC (FCI) 10018784-10212TLF | 98 | Solder | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold | Cantilever | Black | Through Hole | Dual | PCI Express™ | Female | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C | Flash | ||||
Amphenol ICC (FCI) 10018784-00101TLF | 64 | Solder, Staggered | 0.039 in | 1 mm | 2 | Board Guide, Locking Ramp | 0.062 in | 1.57 mm | Gold or Gold, GXT™ | White | Through Hole | Dual | PCI Express™ | Female | 0.38 µm | 15 µin | Copper Alloy | Glass Filled, Nylon, Polyamide (PA) | 85 °C | -55 °C |