HTSW-225-17-G-S
ActiveSamtec Inc.
CONN HEADER VERT 25POS 5.08MM
Deep-Dive with AI
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HTSW-225-17-G-S
ActiveSamtec Inc.
CONN HEADER VERT 25POS 5.08MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HTSW-225-17-G-S |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Mating | 15.75 mm |
| Contact Length - Mating | 0.62 in |
| Contact Length - Post | 2.79 mm |
| Contact Length - Post [x] | 0.11 in |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | Varies by Wire Gauge |
| Fastening Type | Push-Pull |
| Insulation Color | Natural |
| Insulation Height | 0.1 in |
| Insulation Height | 2.54 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Overall Contact Length | 0.83 in |
| Overall Contact Length | 21.08 mm |
| Pitch - Mating | 5.08 mm |
| Pitch - Mating | 0.2 in |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
HTSW-225 Series
| Part | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Style | Current Rating (Amps) | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Length - Post | Contact Length - Post | Number of Positions | Fastening Type | Connector Type | Insulation Color | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Number of Rows | Contact Length - Mating [x] | Contact Length - Mating | Insulation Material | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Shape | Contact Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Contact Material | Overall Contact Length | Overall Contact Length | Contact Length - Post [x] | Contact Length - Post [x] | Contact Length - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | UL94 V-0 | Gold | 3 µin | 0.076 µm | Board to Board Cable | Varies by Wire Gauge | 8.13 mm | 0.32 in | All | 0.09 " | 2.29 mm | 75 | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 3 | 0.23 in | 5.84 mm | Liquid Crystal Polymer (LCP) | 2.54 mm | 0.1 in | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole Right Angle | Phosphor Bronze | |||||
Samtec Inc. | UL94 V-0 | Gold | 3 µin | 0.076 µm | Board to Board Cable | Varies by Wire Gauge | 2.54 mm | 0.1 in | All | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 1 | 0.23 in | 5.84 mm | Liquid Crystal Polymer (LCP) | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole | Phosphor Bronze | 13.46 mm | 0.53 in | 5.08 mm | 0.2 in | ||||||
Samtec Inc. | UL94 V-0 | Gold | 3 µin | 0.076 µm | Board to Board Cable | Varies by Wire Gauge | 2.54 mm | 0.1 in | All | 0.1 in | 2.54 mm | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 1 | 0.23 in | 5.84 mm | Liquid Crystal Polymer (LCP) | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole | Phosphor Bronze | 10.92 mm | 0.43 in | ||||||
Samtec Inc. | UL94 V-0 | Gold | 3 µin | 0.076 µm | Board to Board Cable | Varies by Wire Gauge | 2.54 mm | 0.1 in | All | 2.79 mm | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 1 | 15.75 mm | Liquid Crystal Polymer (LCP) | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole | Phosphor Bronze | 21.08 mm | 0.83 in | 0.11 in | 0.62 in | ||||||
Samtec Inc. | UL94 V-0 | Gold | 3 µin | 0.076 µm | Board to Board Cable | Varies by Wire Gauge | 2.54 mm | 0.1 in | All | 0.5 in | 12.7 mm | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 1 | 0.23 in | 5.84 mm | Liquid Crystal Polymer (LCP) | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole | Phosphor Bronze | 21.08 mm | 0.83 in | ||||||
Samtec Inc. | UL94 V-0 | Tin | Board to Board Cable | Varies by Wire Gauge | 2.54 mm | 0.1 in | All | 0.115 in | 2.92 mm | Push-Pull | Header | Natural | Gold | 5.08 mm | 0.2 in | -55 °C | 125 °C | Unshrouded | 1 | 0.23 in | 5.84 mm | Liquid Crystal Polymer (LCP) | Square | Male Pin | 10 çin | 0.25 çm | Solder | Through Hole | Phosphor Bronze | 11.3 mm | 0.445 " |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 5.35 | |
Description
General part information
HTSW-225 Series
Connector Header Through Hole 25 position 0.200" (5.08mm)
Documents
Technical documentation and resources
No documents available