HTSW-225 Series

Catalog

CONN HEADER R/A 75POS 5.08MM

Part	Material Flammability Rating	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Style	Current Rating (Amps)	Insulation Height	Insulation Height	Number of Positions Loaded	Contact Length - Post	Contact Length - Post	Number of Positions	Fastening Type	Connector Type	Insulation Color	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Number of Rows	Contact Length - Mating [x]	Contact Length - Mating	Insulation Material	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Shape	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Mounting Type	Contact Material	Overall Contact Length	Overall Contact Length	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating
Samtec Inc. HTSW-225-08-G-T-RA	UL94 V-0	Gold	3 µin	0.076 µm	Board to Board Cable	Varies by Wire Gauge	8.13 mm	0.32 in	All	0.09 "	2.29 mm	75	Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	3	0.23 in	5.84 mm	Liquid Crystal Polymer (LCP)	2.54 mm	0.1 in	Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole Right Angle	Phosphor Bronze
Samtec Inc. HTSW-225-08-G-S	UL94 V-0	Gold	3 µin	0.076 µm	Board to Board Cable	Varies by Wire Gauge	2.54 mm	0.1 in	All				Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	1	0.23 in	5.84 mm	Liquid Crystal Polymer (LCP)			Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole	Phosphor Bronze	13.46 mm	0.53 in	5.08 mm	0.2 in
Samtec Inc. HTSW-225-07-G-S	UL94 V-0	Gold	3 µin	0.076 µm	Board to Board Cable	Varies by Wire Gauge	2.54 mm	0.1 in	All	0.1 in	2.54 mm		Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	1	0.23 in	5.84 mm	Liquid Crystal Polymer (LCP)			Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole	Phosphor Bronze	10.92 mm	0.43 in
Samtec Inc. HTSW-225-17-G-S	UL94 V-0	Gold	3 µin	0.076 µm	Board to Board Cable	Varies by Wire Gauge	2.54 mm	0.1 in	All		2.79 mm		Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	1		15.75 mm	Liquid Crystal Polymer (LCP)			Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole	Phosphor Bronze	21.08 mm	0.83 in		0.11 in	0.62 in
Samtec Inc. HTSW-225-10-G-S	UL94 V-0	Gold	3 µin	0.076 µm	Board to Board Cable	Varies by Wire Gauge	2.54 mm	0.1 in	All	0.5 in	12.7 mm		Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	1	0.23 in	5.84 mm	Liquid Crystal Polymer (LCP)			Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole	Phosphor Bronze	21.08 mm	0.83 in
Samtec Inc. HTSW-225-23-L-S	UL94 V-0	Tin			Board to Board Cable	Varies by Wire Gauge	2.54 mm	0.1 in	All	0.115 in	2.92 mm		Push-Pull	Header	Natural	Gold	5.08 mm	0.2 in	-55 °C	125 °C	Unshrouded	1	0.23 in	5.84 mm	Liquid Crystal Polymer (LCP)			Square	Male Pin	10 çin	0.25 çm	Solder	Through Hole	Phosphor Bronze	11.3 mm	0.445 "