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26-1518-11H

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Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

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26-1518-11H

Active
Aries Electronics

CONN IC DIP SOCKET 26POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification26-1518-11H
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesOpen Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
TypeDIP
Type5.08 mm
Type0.2 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 76$ 5.73

Description

General part information

26-1518 Series

26 (2 x 13) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources