26-1518 Series

Catalog

26P DIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Housing Material	Mounting Type	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Type	Type	Type	Current Rating (Amps)	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish - Post	Material Flammability Rating	Termination	Termination Post Length	Termination Post Length
Aries Electronics 26-1518-11	Brass	10 çin	0.25 çm	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Open Frame	10 çin	0.25 çm	Gold	DIP	5.08 mm	0.2 in	3 A	Beryllium Copper	2.54 mm	0.1 in	Gold	UL94 V-0	Solder	3.18 mm	0.125 in
Aries Electronics 26-1518-10T	Brass	10 çin	0.25 çm	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Open Frame	200 µin	5.08 µm	Gold	DIP	5.08 mm	0.2 in	3 A	Beryllium Copper	2.54 mm	0.1 in	Tin	UL94 V-0	Solder	3.18 mm	0.125 in
Aries Electronics 26-1518-11H	Brass	10 çin	0.25 çm	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Open Frame	10 çin	0.25 çm	Gold	DIP	5.08 mm	0.2 in	3 A	Beryllium Copper	2.54 mm	0.1 in	Gold	UL94 V-0	Solder	3.18 mm	0.125 in