HMTSW-124-12-G-S-730-RA

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Samtec Inc.

CONN HEADER R/A 24POS 2.54MM

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DocumentsHMTSW/MTSW/TSW Footprint Datasheet

HMTSW-124-12-G-S-730-RA

Active

Samtec Inc.

CONN HEADER R/A 24POS 2.54MM

Deep-Dive with AI

DocumentsHMTSW/MTSW/TSW Footprint Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-124-12-G-S-730-RA

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	0.73 in
Contact Length - Mating	18.54 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	3.1 mm
Insulation Height	0.122 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	24
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-124 Series

Part	Shrouding	Insulation Material	Number of Positions	Material Flammability Rating	Contact Length - Post [x]	Contact Length - Post [x]	Pitch - Mating	Pitch - Mating	Style	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Termination	Overall Contact Length	Overall Contact Length	Current Rating (Amps)	Insulation Height	Insulation Height	Contact Type	Contact Length - Mating	Contact Length - Mating	Number of Positions Loaded	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material	Insulation Color	Fastening Type	Contact Finish - Mating	Number of Rows	Contact Shape	Connector Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Post	Contact Length - Post	Contact Length - Mating [x]	Contact Length - Mating [x]
Samtec Inc. HMTSW-124-12-G-S-730	Unshrouded	Liquid Crystal Polymer (LCP)	24	UL94 V-0	5.08 mm	0.2 in	0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder	1.03 in	26.16 mm	3 A	0.1 in	2.54 mm	Male Pin	0.73 in	18.54 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Natural	Push-Pull	Gold	1	Square	Header
Samtec Inc. HMTSW-124-10-L-D-540	Unshrouded	Liquid Crystal Polymer (LCP)	48	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Tin	Solder	0.83 in	21.08 mm	3 A	0.1 in	2.54 mm	Male Pin			All			10 çin	0.25 çm	Through Hole	Phosphor Bronze	Natural	Push-Pull	Gold	2	Square	Header	2.54 mm	0.1 in	4.83 mm	0.19 in
Samtec Inc. HMTSW-124-08-G-D-229	Unshrouded	Liquid Crystal Polymer (LCP)	48	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder	0.53 in	13.46 mm	3 A	0.1 in	2.54 mm	Male Pin	0.229 in	5.82 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Natural	Push-Pull	Gold	2	Square	Header	2.54 mm	0.1 in	5.11 mm	0.201 in
Samtec Inc. HMTSW-124-08-G-D-225	Unshrouded	Liquid Crystal Polymer (LCP)	48	UL94 V-0	5.21 mm	0.205 in	0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder	0.53 in	13.46 mm	3 A	0.1 in	2.54 mm	Male Pin	0.225 in	5.72 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Natural	Push-Pull	Gold	2	Square	Header	2.54 mm	0.1 in
Samtec Inc. HMTSW-124-12-G-S-730-RA	Unshrouded	Liquid Crystal Polymer (LCP)	24	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder			3 A	0.122 in	3.1 mm	Male Pin	0.73 in	18.54 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole Right Angle	Phosphor Bronze	Natural	Push-Pull	Gold	1	Square	Header
Samtec Inc. HMTSW-124-28-G-S-100-RA	Unshrouded	Liquid Crystal Polymer (LCP)	24	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder			3 A	0.122 in	3.1 mm	Male Pin	0.1 in	2.54 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole Right Angle	Phosphor Bronze	Natural	Push-Pull	Gold	1	Square	Header
Samtec Inc. HMTSW-124-12-SM-Q-730-RA	Unshrouded	Liquid Crystal Polymer (LCP)	48	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Tin	Solder			3 A	0.319 in	8.1 mm	Male Pin	0.73 in	18.54 mm	All			30 Áin	0.76 Ám	Through Hole Right Angle	Phosphor Bronze	Natural	Push-Pull	Gold	2	Square	Header	5.08 mm	0.2 "
Samtec Inc. HMTSW-124-09-G-S-190	Unshrouded	Liquid Crystal Polymer (LCP)	24	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Gold	Solder	0.73 in	18.54 mm	3 A	0.1 in	2.54 mm	Male Pin	0.19 "	4.83 mm	All	3 µin	0.076 µm	10 çin	0.25 çm	Through Hole	Phosphor Bronze	Natural	Push-Pull	Gold	1	Square	Header			11.18 mm	0.44 in
Samtec Inc. HMTSW-124-08-L-T-200-RA	Unshrouded	Liquid Crystal Polymer (LCP)	72	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	125 °C	Tin	Solder			3 A	0.319 in	8.1 mm	Male Pin			All			10 çin	0.25 çm	Through Hole Right Angle	Phosphor Bronze	Natural	Push-Pull	Gold	3	Square	Header	2.54 mm	0.1 in			5.08 mm	0.2 in
Samtec Inc. HMTSW-124-08-TM-S-175-RA	Unshrouded	Liquid Crystal Polymer (LCP)	24	UL94 V-0			0.1 in	2.54 mm	Board to Board Cable	-55 °C	105 ░C	Tin	Solder			3 A	0.122 in	3.1 mm	Male Pin	0.175 in	4.45 mm	All					Through Hole Right Angle	Phosphor Bronze	Natural	Push-Pull		1	Square	Header

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 4.57

Description

General part information

HMTSW-124 Series

Connector Header Through Hole, Right Angle 24 position 0.100" (2.54mm)

Documents

Technical documentation and resources

HMTSW/MTSW/TSW Footprint

Datasheet