HMTSW-124 Series

Catalog

CONN HEADER VERT 24POS 2.54MM

Part	Contact Finish Thickness - Post	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Mating	Termination	Contact Material	Mounting Type	Material Flammability Rating	Contact Finish - Post	Insulation Material	Insulation Height	Fastening Type	Number of Rows	Contact Length - Post	Current Rating	Insulation Color	Contact Length - Mating	Contact Type	Contact Finish Thickness - Mating	Style	Overall Contact Length	Contact Finish - Mating	Shrouding	Contact Shape	Number of Positions Loaded	Connector Type	Number of Positions	Row Spacing - Mating
Samtec Inc. HMTSW-124-12-G-S-730	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	1	0.2 in	3 A	Natural	0.73 in	Male Pin	10 µin	Board Board or Cable	1.03 in	Gold	Unshrouded	Square	All	Header	24 pos
Samtec Inc. HMTSW-124-10-L-D-540		125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Tin	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	2	0.19 in	3 A	Natural	0.54 in	Male Pin	10 µin	Board Board or Cable	0.83 in	Gold	Unshrouded	Square	All	Header	48	0.1 in
Samtec Inc. HMTSW-124-08-G-D-229	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	2	0.201 in	3 A	Natural	0.229 in	Male Pin	10 µin	Board Board or Cable	0.53 in	Gold	Unshrouded	Square	All	Header	48	0.1 in
Samtec Inc. HMTSW-124-08-G-D-225	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	2	0.205 in	3 A	Natural	0.225 in	Male Pin	10 µin	Board Board or Cable	0.53 in	Gold	Unshrouded	Square	All	Header	48	0.1 in
Samtec Inc. HMTSW-124-08-T-T-200-RA		105 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Right Angle Through Hole	UL94 V-0	Tin	Liquid Crystal Polymer (LCP)	0.319 in	Push-Pull	3		3 A	Natural	0.2 in	Male Pin		Board Board or Cable		Tin	Unshrouded	Square	All	Header	72	0.1 in
Samtec Inc. HMTSW-124-12-G-S-730-RA	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Right Angle Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.122 in	Push-Pull	1		3 A	Natural	0.73 in	Male Pin	10 µin	Board Board or Cable		Gold	Unshrouded	Square	All	Header	24 pos
Samtec Inc. HMTSW-124-28-G-S-100-RA	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Right Angle Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.122 in	Push-Pull	1		3 A	Natural	0.1 in	Male Pin	10 µin	Board Board or Cable		Gold	Unshrouded	Square	All	Header	24 pos
Samtec Inc. HMTSW-124-12-SM-Q-730-RA		125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Right Angle Through Hole	UL94 V-0	Tin	Liquid Crystal Polymer (LCP)	0.319 in	Push-Pull	2		3 A	Natural	0.73 in	Male Pin	30 µin	Board Board or Cable		Gold	Unshrouded	Square	All	Header	48	0.2 in
Samtec Inc. HMTSW-124-09-G-S-190	3 µin	125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Gold	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	1	0.44 in	3 A	Natural	0.19 in	Male Pin	10 µin	Board Board or Cable	0.73 in	Gold	Unshrouded	Square	All	Header	24 pos
Samtec Inc. HMTSW-124-13-L-S-960		125 °C	-55 °C	0.1 in	Solder	Phosphor Bronze	Through Hole	UL94 V-0	Tin	Liquid Crystal Polymer (LCP)	0.1 in	Push-Pull	1	0.17 in	3 A	Natural	0.96 in	Male Pin	10 µin	Board Board or Cable	1.23 in	Gold	Unshrouded	Square	All	Header	24 pos