SFMC-114-02-S-D-K-TR
ActiveSamtec Inc.
CONN RCPT 28POS 0.05 GOLD SMD
Deep-Dive with AI
Search across all available documentation for this part.
SFMC-114-02-S-D-K-TR
ActiveSamtec Inc.
CONN RCPT 28POS 0.05 GOLD SMD
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SFMC-114-02-S-D-K-TR |
|---|---|
| Connector Type | Receptacle |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 30 Áin |
| Contact Finish Thickness - Mating | 0.76 Ám |
| Contact Material | Beryllium Copper |
| Contact Shape | Square |
| Contact Type | Female Socket |
| Current Rating (Amps) | 2.9 A |
| Fastening Type | Push-Pull |
| Features | Pick and Place |
| Insulation Color | Black |
| Insulation Height | 0.185 in |
| Insulation Height | 4.7 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Number of Positions | 28 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating | 0.05 in |
| Pitch - Mating | 1.27 mm |
| Row Spacing - Mating | 0.05 in |
| Row Spacing - Mating | 1.27 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
SFMC-114 Series
| Part | Current Rating (Amps) | Features | Contact Material | Row Spacing - Mating | Row Spacing - Mating | Style | Fastening Type | Insulation Height | Insulation Height | Pitch - Mating | Pitch - Mating | Number of Positions | Insulation Material | Termination | Number of Rows | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Insulation Color | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Contact Finish - Mating | Contact Finish - Post | Connector Type | Contact Shape | Contact Length - Post [x] | Contact Length - Post [x] | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2.9 A | Pick and Place | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.57 mm | 0.18 " | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Through Hole | 10 çin | 0.25 çm | UL94 V-0 | Gold | Tin | Receptacle | Square | 0.12 in | 3.05 mm | All |
Samtec Inc. | 2.9 A | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.7 mm | 0.185 in | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Surface Mount | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | All | |||
Samtec Inc. | 2.9 A | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.57 mm | 0.18 " | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Through Hole | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | 0.12 in | 3.05 mm | All | |
Samtec Inc. | 2.9 A | Phosphor Bronze | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.7 mm | 0.185 in | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Surface Mount | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | All | |||
Samtec Inc. | 2.9 A | Pick and Place | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.57 mm | 0.18 " | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Through Hole | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | 0.12 in | 3.05 mm | All |
Samtec Inc. | 2.9 A | Pick and Place | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.7 mm | 0.185 in | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Surface Mount | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | All | ||
Samtec Inc. | 2.9 A | Pick and Place | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.7 mm | 0.185 in | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Surface Mount | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | All | ||
Samtec Inc. | 2.9 A | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.57 mm | 0.18 " | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Through Hole | 3 µin | 0.076 µm | UL94 V-0 | Gold | Tin | Receptacle | Square | 0.12 in | 3.05 mm | All | |
Samtec Inc. | 2.9 A | Phosphor Bronze | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.57 mm | 0.18 " | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Through Hole | 30 Áin | 0.76 Ám | UL94 V-0 | Gold | Tin | Receptacle | Square | 0.12 in | 3.05 mm | All | |
Samtec Inc. | 2.9 A | Pick and Place | Beryllium Copper | 0.05 in | 1.27 mm | Board to Board Cable | Push-Pull | 4.7 mm | 0.185 in | 0.05 in | 1.27 mm | 28 | Liquid Crystal Polymer (LCP) | Solder | 2 | -55 °C | 125 °C | Female Socket | Black | Surface Mount | 10 çin | 0.25 çm | UL94 V-0 | Gold | Tin | Receptacle | Square | All |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 7.80 | |
| 10 | $ 7.21 | |||
| 25 | $ 6.82 | |||
| 50 | $ 6.57 | |||
| 100 | $ 5.04 | |||
| Digi-Reel® | 1 | $ 7.80 | ||
| 10 | $ 7.21 | |||
| 25 | $ 6.82 | |||
| 50 | $ 6.57 | |||
| 100 | $ 5.04 | |||
| Tape & Reel (TR) | 875 | $ 4.53 | ||
| 1750 | $ 4.36 | |||
Description
General part information
SFMC-114 Series
28 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold
Documents
Technical documentation and resources