SFMC-114 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN RCPT 28POS 0.05 GOLD PCB
| Part | Current Rating (Per Contact) | Insulation Color | Fastening Type | Contact Finish Thickness - Mating | Contact Type | Contact Finish - Mating | Pitch - Mating | Connector Type | Operating Temperature (Max) | Operating Temperature (Min) | Features | Contact Finish - Post | Row Spacing - Mating | Material Flammability Rating | Style | Number of Positions Loaded | Mounting Type | Termination | Insulation Height | Number of Positions | Contact Length - Post | Number of Rows | Insulation Material | Contact Shape | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | 2.9 A | Black | Push-Pull | 10 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Pick and Place | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper |
 Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Surface Mount | Solder | 0.185 in | 28 | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | ||
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Surface Mount | Solder | 0.185 in | 28 | 2 | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Pick and Place | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper |
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Pick and Place | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Surface Mount | Solder | 0.185 in | 28 | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |
 Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Pick and Place | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Surface Mount | Solder | 0.185 in | 28 | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |
Samtec Inc. | 2.9 A | Black | Push-Pull | 3 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Beryllium Copper | |
Samtec Inc. | 2.9 A | Black | Push-Pull | 30 µin | Female Socket | Gold | 0.05 in | Receptacle | 125 °C | -55 °C | Tin | 0.05 in | UL94 V-0 | Board Board or Cable | All | Through Hole | Solder | 0.18 in | 28 | 0.12 in | 2 | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze |