Specification	200-6321-9UN-1900

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating	1 A
Grid Columns	21
Grid Rows	21
Housing Material	PES, Polyethersulfone
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	441
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.13 in
Type	PGA, ZIF (ZIP)

200 Series

Part	Pitch - Mating	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Contact Material - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Pitch - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Mating	Housing Material	Type	Material Flammability Rating	Current Rating	Termination Post Length	For Use With/Related Products	Accessory Type
3M Electronic Specialty 200-6321-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	441	21	21	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6319-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	361	19	19	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6313-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	169	13	13	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6325-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	625	25	25	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-4660-14-1900													150 °C	-55 °C				UL94 V-0			3M™ PGA Sockets	Plug
3M Electronic Specialty 200-6317-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	289	17	17	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6311-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	121	11	11	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in

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200-6321-9UN-1900 | Datasheet

Txtool™ Burn-In Grid ZIP Sockets