200 Series

Catalog

CONN SOCKET PGA ZIF 441POS GOLD

Part	Pitch - Mating	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Contact Material - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Pitch - Post	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Mating	Housing Material	Type	Material Flammability Rating	Current Rating	Termination Post Length	For Use With/Related Products	Accessory Type
3M Electronic Specialty 200-6321-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	441	21	21	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6319-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	361	19	19	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6313-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	169	13	13	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6325-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	625	25	25	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-4660-14-1900													150 °C	-55 °C				UL94 V-0			3M™ PGA Sockets	Plug
3M Electronic Specialty 200-6317-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	289	17	17	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in
3M Electronic Specialty 200-6311-9UN-1900	0.1 in	Gold	Gold	Through Hole	Beryllium Copper	Solder	30 µin	30 µin	0.1 in	121	11	11	150 °C	-55 °C	Beryllium Copper	PES Polyethersulfone	PGA ZIF (ZIP)	UL94 V-0	1 A	0.13 in