Specification	28-3552-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Features	Closed Frame
Grid Columns	14
Grid Rows	2
Housing Material	PPS, Glass Filled, Polyphenylene Sulfide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Type	ZIF (ZIP), DIP, 0.3" (7.62mm) Row Spacing

X55X Series

Part	Current Rating	Termination Post Length	Material Flammability Rating	Row Spacing	Type	Contact Finish - Mating	Features	Contact Finish - Post	Termination	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Pitch - Post	Housing Material	Contact Finish Thickness - Post	Mounting Type	Contact Material - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Operating Temperature (Max)	Operating Temperature (Min)
Aries Electronics 24-3554-16	1 A	0.11 in	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Nickel Boron	Solder	2	24	12	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin
Aries Electronics 32-6554-16				0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Nickel Boron	Solder	2	32	16	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS	50 µin	Through Hole	Beryllium Copper	Beryllium Copper	50 µin
Aries Electronics 36-6551-18				0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Nickel Boron	Solder	2	36	18	0.1 in	0.1 in	Glass Filled PEEK Polyetheretherketone	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	250 °C	-55 °C
Aries Electronics 24-3553-11	1 A	0.11 in	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Gold	Closed Frame	Gold	Solder	2	24	12	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS		Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 36-3554-18	1 A	0.11 in	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Nickel Boron	Solder	2	36	18	0.1 in	0.1 in	Glass Filled PEEK Polyetheretherketone	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	250 °C	-55 °C
Aries Electronics 48-3552-18	1 A	0.11 in	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Boron Nickel	Closed Frame	Nickel Boron	Solder	2	48	24	0.1 in	0.1 in	Glass Filled PEEK Polyetheretherketone	50 µin	Through Hole	Beryllium Nickel	Beryllium Nickel	50 µin	250 °C	-55 °C
Aries Electronics 28-6554-11	1 A	0.11 in	UL94 V-0	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Gold	Closed Frame	Gold	Solder	2	28	14	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS		Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 40-6552-10	1 A	0.11 in	UL94 V-0	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Tin	Closed Frame	Tin	Solder	2	40	20	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS	200 µin	Through Hole	Beryllium Copper	Beryllium Copper	200 Ąin
Aries Electronics 32-6552-11	1 A	0.11 in	UL94 V-0	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Gold	Closed Frame	Gold	Solder	2	32	16	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS		Through Hole	Beryllium Copper	Beryllium Copper
Aries Electronics 32-3553-11	1 A	0.11 in	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Gold	Closed Frame	Gold	Solder	2	32	16	0.1 in	0.1 in	Glass Filled Polyphenylene Sulfide PPS		Through Hole	Beryllium Copper	Beryllium Copper

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28-3552-11 | Datasheet