48-3552 Series
Manufacturer: Aries Electronics
Catalog
CONN IC DIP SOCKET ZIF 48POS
| Part | Features | Material Flammability Rating | Termination | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Number of Positions or Pins (Grid) | Housing Material | Contact Material - Post | Contact Finish - Post | Contact Finish - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Termination Post Length | Termination Post Length | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | UL94 V-0 | Solder | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | -55 °C | 250 °C | 1 A | 48 | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | Nickel Boron | Nickel Boron | Through Hole | 1.27 µm | 50 µin | Beryllium Nickel | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1.27 µm | 50 µin |
Aries Electronics | Closed Frame | UL94 V-0 | Solder | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 1 A | 48 | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Gold | Gold | Through Hole | Beryllium Copper | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | ||||||
Aries Electronics | Closed Frame | UL94 V-0 | Solder | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 1 A | 48 | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Nickel Boron | Nickel Boron | Through Hole | 1.27 µm | 50 µin | Beryllium Copper | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1.27 µm | 50 µin | ||
Aries Electronics | Closed Frame | UL94 V-0 | Solder | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 1 A | 48 | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Tin | Through Hole | 5.08 µm | 200 µin | Beryllium Copper | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 5.08 µm | 200 µin |