28-6554-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 28POS GLD

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28-6554-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 28POS GLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	28-6554-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	15.24 mm
Type	DIP, ZIF (ZIP)
Type	0.6 "

28-6554 Series

Part	Termination	Current Rating (Amps)	Contact Material - Post	Contact Finish - Mating	Features	Pitch - Mating	Pitch - Mating	Housing Material	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Mounting Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 28-6554-16	Solder	1 A	Beryllium Copper	Nickel Boron	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin
Aries Electronics 28-6554-10	Solder	1 A	Beryllium Copper		Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Tin	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper	5.08 µm	200 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	5.08 µm	200 µin
Aries Electronics 28-6554-11	Solder	1 A	Beryllium Copper	Gold	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper			15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 28-6554-18	Solder	1 A	Beryllium Nickel	Nickel Boron	Closed Frame	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Nickel	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin	-55 °C	250 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 21.08
		18	$ 18.46
		27	$ 17.66
		54	$ 17.09
		108	$ 16.52
		252	$ 15.61
		504	$ 15.15

Description

General part information

28-6554 Series

28 (2 x 14) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources