28-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS

Part	Termination	Current Rating (Amps)	Contact Material - Post	Contact Finish - Mating	Features	Pitch - Mating	Pitch - Mating	Housing Material	Contact Finish - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Mounting Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 28-6554-16	Solder	1 A	Beryllium Copper	Nickel Boron	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin
Aries Electronics 28-6554-10	Solder	1 A	Beryllium Copper		Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Tin	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper	5.08 µm	200 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	5.08 µm	200 µin
Aries Electronics 28-6554-11	Solder	1 A	Beryllium Copper	Gold	Closed Frame	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Copper			15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 28-6554-18	Solder	1 A	Beryllium Nickel	Nickel Boron	Closed Frame	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	2.54 mm	0.1 in	0.11 in	2.78 mm	Through Hole	UL94 V-0	28	Beryllium Nickel	1.27 µm	50 µin	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin	-55 °C	250 °C