Specification	HDAF-23-18.0-S-13-2

Connector Type	High Density Array, FEMALE
Contact Finish	Gold
Contact Finish Thickness	30 µin
Features	Board Guide
Height Above Board	0.807 in
Mated Stacking Height Options	30mm, 35mm
Mounting Type	Surface Mount
Number of Positions	299
Number of Rows	13
Pitch	0.047 in

HDAF Series

Board to Board & Mezzanine Connectors 2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket

Part	Mated Stacking Height Options	Features	Number of Rows	Contact Finish	Pitch	Height Above Board	Mounting Type	Connector Type	Number of Positions	Contact Finish Thickness
Samtec Inc. HDAF-11-18.0-S-13-1	30mm 35mm	Board Guide	13	Gold	0.047 in	0.807 in	Surface Mount	FEMALE High Density Array	143	30 µin
Samtec Inc. HDAF-23-18.0-S-13-2	30mm 35mm	Board Guide	13	Gold	0.047 in	0.807 in	Surface Mount	FEMALE High Density Array	299	30 µin
Samtec Inc. HDAF-23-08.0-S-13-2-TR	20mm 25mm	Board Guide	13	Gold	0.047 in	0.414 in	Surface Mount	FEMALE High Density Array	299	30 µin
Samtec Inc. HDAF-23-18.0-S-13-1	30mm 35mm	Board Guide	13	Gold	0.047 in	0.807 in	Surface Mount	FEMALE High Density Array	299	30 µin

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