PMDXB590UPEZ

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Nexperia USA Inc.

20 V, DUAL P-CHANNEL TRENCH MOSFET

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PMDXB590UPEZ

Active

Nexperia USA Inc.

20 V, DUAL P-CHANNEL TRENCH MOSFET

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Description Specifications Series Pricing CAD Documents

Description

General part information

PMDXB590UPE Series

Dual P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010B-6 (SOT1216) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Technical Specifications

Parameters and characteristics for this part

Specification	PMDXB590UPEZ

Channel Count	2
Configuration	P-Channel
Configuration - Features	Dual
Current - Continuous Drain (Id) (Ta)	570 mA
Current - Continuous Drain (Id) (Tc)	2.3 A
Drain to Source Voltage (Vdss)	20 V
Gate Charge (Max)	0.8 nC
Input Capacitance (Ciss) (Max)	53.5 pF
Mounting Type	Surface Mount
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Package / Case	6-XFDFN Exposed Pad
Package Name	DFN1010B-6
Power - Max (Ta)	280 mW
Power - Max (Tc)	6 W
Rds On (Max)	770 mOhm
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max)	1 V

PMDXB590UPE Series

20 V, dual P-channel Trench MOSFET

Part	Technology	Power - Max (Tc)	Power - Max (Ta)	Operating Temperature (Min)	Operating Temperature (Max)	Rds On (Max)	Mounting Type	Package / Case	Package Name	Gate Charge (Max)	Current - Continuous Drain (Id) (Ta)	Current - Continuous Drain (Id) (Tc)	Input Capacitance (Ciss) (Max)	Vgs(th) (Max)	Channel Count	Configuration	Configuration - Features	Drain to Source Voltage (Vdss)
Nexperia USA Inc. PMDXB590UPEZ	MOSFET (Metal Oxide)	6 W	280 mW	-55 °C	150 °C	770 mOhm	Surface Mount	6-XFDFN Exposed Pad	DFN1010B-6	0.8 nC	570 mA	2.3 A	53.5 pF	1 V	2	P-Channel	Dual	20 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

Low temperature soldering, application study

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body

Thermal performance of DFN packages

plastic, leadless thermal enhanced ultra thin small outline package; 6 terminals; 0.35 mm pitch; 1.1 mm x 1 mm x 0.37 mm body

DFN1010B-6; Reel pack for SMD, 7''; Q2/T3 product orientation

Questions about package outline drawings

Reflow soldering profile

Nexperia package poster