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TPD2E007YFMTG4 - TPD2E007YFMRG4

TPD2E007YFMTG4

Active
Texas Instruments

DUAL 10-PF, ±13-V, ±8-KV ESD PROTECTION DIODE FOR AC SIGNAL DATA INTERFACES

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TPD2E007YFMTG4 - TPD2E007YFMRG4

TPD2E007YFMTG4

Active
Texas Instruments

DUAL 10-PF, ±13-V, ±8-KV ESD PROTECTION DIODE FOR AC SIGNAL DATA INTERFACES

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTPD2E007YFMTG4TPD2E007 Series
ApplicationsGeneral PurposeGeneral Purpose
Bidirectional Channels22
Mounting TypeSurface MountSurface Mount
Operating Temperature [Max]85 °C85 °C
Operating Temperature [Min]-40 °C-40 °C
Package / CaseDSLGA, 4-XFLGADSLGA, 4-XFLGA, SOT-323, SC-70
Power Line ProtectionFalseFalse
Supplier Device Package4-DSLGA4-DSLGA, SC-70-3
TypeZenerZener
Voltage - Breakdown (Min) [Min]14 V14 V
Voltage - Reverse Standoff (Typ)13 V13 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

TPD2E007 Series

TVS DIODE 13VWM 4DSLGA

PartApplicationsOperating Temperature [Max]Operating Temperature [Min]Mounting TypeTypeVoltage - Reverse Standoff (Typ)Supplier Device PackagePackage / CaseVoltage - Breakdown (Min) [Min]Bidirectional ChannelsPower Line Protection
Texas Instruments
TPD2E007YFMRG4
Clamp Ipp Tvs Diode Surface Mount 4-DSLGA
General Purpose
85 °C
-40 °C
Surface Mount
Zener
13 V
4-DSLGA
4-XFLGA, DSLGA
14 V
2
Texas Instruments
TPD2E007DCKR
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs. This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
General Purpose
85 °C
-40 °C
Surface Mount
Zener
13 V
SC-70-3
SC-70, SOT-323
14 V
2
Texas Instruments
TPD2E007YFMTG4
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs. This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
General Purpose
85 °C
-40 °C
Surface Mount
Zener
13 V
4-DSLGA
4-XFLGA, DSLGA
14 V
2

Description

General part information

TPD2E007 Series

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.

The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.

This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.