Zenode.ai Logo

TPD2E007 Series

Dual 10-pF, ±13-V, ±8-kV ESD protection diode for AC Signal Data Interfaces

Manufacturer: Texas Instruments

Catalog(3 parts)

PartPower Line ProtectionTypeOperating TemperatureOperating TemperatureVoltage - Breakdown (Min)Package / CaseSupplier Device PackageVoltage - Reverse Standoff (Typ)ApplicationsMounting TypeBidirectional Channels
Texas Instruments
TPD2E007YFMTG4
Clamp Ipp Tvs Diode Surface Mount 4-DSLGA
Zener
85 °C
-40 °C
14 V
4-XFLGA, DSLGA
4-DSLGA
13 V
General Purpose
Surface Mount
2 ul
Texas Instruments
TPD2E007YFMRG4
Clamp Ipp Tvs Diode Surface Mount 4-DSLGA
Zener
85 °C
-40 °C
14 V
4-XFLGA, DSLGA
4-DSLGA
13 V
General Purpose
Surface Mount
2 ul
Texas Instruments
TPD2E007DCKR
Clamp Ipp Tvs Diode Surface Mount SC-70-3
Zener
85 °C
-40 °C
14 V
SC-70, SOT-323
SC-70-3
13 V
General Purpose
Surface Mount
2 ul

Key Features

IEC 61000-4-2 Level 4 ESD Protection±8-kV IEC 61000-4-2 Contact Discharge±15-kV IEC 61000-4-2 Air-Gap DischargeIEC 61000-4-5 Surge Protection4.5-A Peak Pulse Current (8/20-µs Pulse)IO Capacitance 15 pF (Max)Low 50-nA Leakage CurrentSpace-Saving PicoStar™ and SOT PackageIEC 61000-4-2 Level 4 ESD Protection±8-kV IEC 61000-4-2 Contact Discharge±15-kV IEC 61000-4-2 Air-Gap DischargeIEC 61000-4-5 Surge Protection4.5-A Peak Pulse Current (8/20-µs Pulse)IO Capacitance 15 pF (Max)Low 50-nA Leakage CurrentSpace-Saving PicoStar™ and SOT Package

Description

AI
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs. This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector. The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.