Specification	28-3574-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating	1 A
Features	Closed Frame
Grid Columns	14
Grid Rows	2
Housing Material	PPS, Glass Filled, Polyphenylene Sulfide
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	28
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.3 in
Termination	Solder
Termination Post Length	0.11 in
Type	ZIF (ZIP), DIP, 0.3" (7.62mm) Row Spacing

28-3574 Series

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Finish - Mating	Termination	Housing Material	Contact Material - Post	Contact Finish - Post	Row Spacing	Type	Contact Finish Thickness - Mating	Pitch - Post	Contact Material - Mating	Mounting Type	Contact Finish Thickness - Post	Features	Pitch - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows
Aries Electronics 28-3574-11	0.11 in	1 A	UL94 V-0	Gold	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	10 µin	0.1 in	Beryllium Copper	Through Hole	10 µin	Closed Frame	0.1 in	14	28	2
Aries Electronics 28-3574-16	0.11 in	1 A	UL94 V-0	Gold	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	10 µin	0.1 in	Beryllium Copper	Through Hole	10 µin	Closed Frame	0.1 in	14	28	2

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