28-3574 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS GLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Contact Finish - Mating | Termination | Housing Material | Contact Material - Post | Contact Finish - Post | Row Spacing | Type | Contact Finish Thickness - Mating | Pitch - Post | Contact Material - Mating | Mounting Type | Contact Finish Thickness - Post | Features | Pitch - Mating | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Gold | Solder | Glass Filled Polyphenylene Sulfide PPS | Beryllium Copper | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 10 µin | 0.1 in | Beryllium Copper | Through Hole | 10 µin | Closed Frame | 0.1 in | 14 | 28 | 2 |
Aries Electronics | 0.11 in | 1 A | UL94 V-0 | Gold | Solder | Glass Filled Polyphenylene Sulfide PPS | Beryllium Copper | Gold | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 10 µin | 0.1 in | Beryllium Copper | Through Hole | 10 µin | Closed Frame | 0.1 in | 14 | 28 | 2 |