58-1518-00

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Aries Electronics

CONN IC DIP SOCKET 58POS GOLD

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Aries Electronics

CONN IC DIP SOCKET 58POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	58-1518-00

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	58
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	DIP
Type	5.08 mm
Type	0.2 in

CONN IC DIP SOCKET 58POS GOLD

Part	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Termination	Number of Positions or Pins (Grid)	Current Rating (Amps)	Contact Material - Post [custom]	Features	Mounting Type	Contact Finish - Mating
Aries Electronics 58-1518-00	Beryllium Copper	2.54 mm	0.1 in	200 µin	5.08 µm	DIP	5.08 mm	0.2 in	0.1 in	2.54 mm	Tin	10 çin	0.25 çm	3.18 mm	0.125 in	UL94 V-0	Glass Filled, Nylon 4/6, Polyamide (PA46)	Solder	58	3 A	Brass	Open Frame	Surface Mount	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	40	$ 11.65

General part information

58 (2 x 29) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Surface Mount

Technical documentation and resources