CONN IC DIP SOCKET 58POS GOLD
| Part | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Material Flammability Rating | Housing Material | Termination | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Material - Post [custom] | Features | Mounting Type | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 58-1518-00 | Beryllium Copper | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | DIP | 5.08 mm | 0.2 in | 0.1 in | 2.54 mm | Tin | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | UL94 V-0 | Glass Filled, Nylon 4/6, Polyamide (PA46) | Solder | 58 | 3 A | Brass | Open Frame | Surface Mount | Gold |