240-3639-19-0602J

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IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 25.4 MM, BERYLLIUM COPPER

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240-3639-19-0602J

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IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 25.4 MM, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	240-3639-19-0602J	240 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 - 30 µm
Contact Finish Thickness - Post	-	0.76 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	15 - 25 mOhm
Convert From (Adapter End)	DIP	DIP
Convert From (Adapter End)	25.4 mm	0.6 - 25.4 in
Convert From (Adapter End)	1 in	1 in
Convert From (Adapter End)	-	15.24 mm
Convert To (Adapter End)	1 "	1 - 15.24 mm
Convert To (Adapter End)	DIP	DIP
Convert To (Adapter End)	25.4 mm	25.4 mm
Convert To (Adapter End)	-	0.6 in
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polyethersulfone (PES), Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Connector
Number of Pins	40	40
Number of Positions or Pins (Grid)	-	10 - 20
Number of Positions or Pins (Grid)	-	40
Number of Positions or Pins (Grid)	-	2 - 4
Number of Positions or Pins (Grid)	-	40
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Wire Wrap	Solder, Press-Fit, Wire Wrap
Termination Post Length	-	0.11 - 0.13 in
Termination Post Length	-	2.78 - 3.3 mm
Termination Post Length [x]	0.62 in	0.62 in
Termination Post Length [x]	15.75 mm	15.75 mm
Type	-	QFN, DIP, ZIF (ZIP)
Type	-	15.24 mm
Type	-	0.6 "

240 Series

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

Part	Contact Material - Post	Housing Material	Contact Resistance	Contact Finish - Mating	Features	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Contact Finish - Post	Contact Material - Mating	Termination	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Type	Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Convert To (Adapter End)	Convert From (Adapter End)	Contact Finish Thickness - Post
3M 240-5205-01	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-00-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled	15 mOhm	Gold	Closed Frame	Connector	20		2	DIP, ZIF (ZIP)	Gold	Beryllium Copper	Press-Fit	0.11 in	2.78 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in	15.24 mm	0.6 "	UL94 V-0	40	1 A	-55 °C	125 °C
3M 240-1280-29-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "	0.62 in	15.75 mm	25.4 mm	1 in
3M 240-5205-00	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold		Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm		30 Áin	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "			25.4 mm	1 in	0.76 Ám
3M 240-1280-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm	0.62 in	15.75 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	20	$ 38.52
Newark	N/A	25	$ 28.38
		50	$ 26.66
		100	$ 25.87

Description

General part information

240 Series

IC Socket Adapter DIP, 1.0" (25.40mm) Row Spacing To DIP, 1.0" (25.40mm) Row Spacing Through Hole