240-1280-00-0602J

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IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER

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240-1280-00-0602J

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IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 40.24
		10	$ 31.11
		25	$ 28.21
		50	$ 26.26
		100	$ 24.49
		250	$ 22.40
Newark	Each	25	$ 28.38
		50	$ 26.66
		100	$ 25.87
		250	$ 24.31
		500	$ 23.52

Description

General part information

240 Series

The 240-1280-00-0602J is a 40-way Textool™ DIP Socket with gold-plated beryllium copper contacts, 2.54mm lead spacing. This socket is glass filled polysulfone insulated, easily disassembles for repairability, lever actuated zero insertion force mechanism.

Documents

Technical documentation and resources

Datasheet

Technical Data Sheet EN

Datasheet

Specification	240-1280-00-0602J	240 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 - 30 µm
Contact Finish Thickness - Post	-	0.76 Ám
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	15 mOhm	15 - 25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 - 25.4 in
Convert From (Adapter End)	-	1 in
Convert To (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	DIP
Convert To (Adapter End)	-	1 - 15.24 mm
Convert To (Adapter End)	-	25.4 mm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polyethersulfone (PES), Polysulfone (PSU), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Connector	Through Hole, Connector
Number of Pins	-	40
Number of Positions or Pins (Grid)	40	40
Number of Positions or Pins (Grid)	-	40
Number of Positions or Pins (Grid) [custom]	20	10 - 20
Number of Positions or Pins (Grid) [custom]	2	2 - 4
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Press-Fit	Solder, Press-Fit, Wire Wrap
Termination Post Length	0.11 in	0.11 - 0.13 in
Termination Post Length	2.78 mm	2.78 - 3.3 mm
Termination Post Length	-	0.62 in
Termination Post Length	-	15.75 mm
Type	15.24 mm	15.24 mm
Type	DIP, ZIF (ZIP)	QFN, DIP, ZIF (ZIP)
Type	0.6 "	0.6 "

Part

Contact Material - Post

Housing Material

Contact Resistance

Contact Finish - Mating

Features

Mounting Type

Number of Positions or Pins (Grid) [custom]

Type

Contact Finish - Post

Contact Material - Mating

Termination

Termination Post Length

Contact Finish Thickness - Mating

Pitch - Mating

Contact Finish Thickness - Post

Pitch - Post

Type

Material Flammability Rating

Number of Positions or Pins (Grid)

Current Rating (Amps)

Operating Temperature [Min]

Operating Temperature [Max]

Convert From (Adapter End)

Number of Pins

Convert To (Adapter End)

Termination Post Length [x]

Convert To (Adapter End)

Convert From (Adapter End)

Contact Finish Thickness - Post

240-5205-01

Beryllium Copper

Polyethersulfone (PES)

25 mOhm

Gold

Closed Frame

Through Hole

QFN

Gold

Beryllium Copper

Solder

0.118 in

3 mm

240-1280-00-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

15 mOhm

Gold

Closed Frame

Connector

DIP, ZIF (ZIP)

Gold

Beryllium Copper

Press-Fit

0.11 in

2.78 mm

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 µin

0.76 µm

2.54 mm

0.1 in

15.24 mm

0.6 "

UL94 V-0

1 A

-55 °C

125 °C

240-1280-29-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

Gold

Closed Frame

Through Hole

Gold

Beryllium Copper

Solder

0.13 in

3.3 mm

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 µin

0.76 µm

2.54 mm

0.1 in

UL94 V-0

1 A

-55 °C

125 °C

15.24 mm

DIP

0.6 in

DIP

15.24 mm

240-3639-19-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

Gold

Closed Frame

Through Hole

Gold

Beryllium Copper

Wire Wrap

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 µin

0.76 µm

2.54 mm

0.1 in

UL94 V-0

1 A

-55 °C

125 °C

DIP

25.4 mm

DIP

1 "

0.62 in

15.75 mm

25.4 mm

1 in

240-5205-00

Beryllium Copper

Polyethersulfone (PES)

25 mOhm

Gold

Closed Frame

Through Hole

QFN

Gold

Beryllium Copper

Solder

0.118 in

3 mm

240-1280-09-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

Gold

Through Hole

Gold

Beryllium Copper

Solder

0.13 in

3.3 mm

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 µin

0.76 µm

2.54 mm

0.1 in

UL94 V-0

1 A

-55 °C

125 °C

15.24 mm

DIP

0.6 in

DIP

15.24 mm

240-3639-09-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

Gold

Closed Frame

Through Hole

Gold

Beryllium Copper

Solder

0.13 in

3.3 mm

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 Áin

2.54 mm

0.1 in

UL94 V-0

1 A

-55 °C

125 °C

DIP

25.4 mm

DIP

1 "

25.4 mm

1 in

0.76 Ám

240-1280-19-0602J

Beryllium Copper

Polysulfone (PSU), Glass Filled

Gold

Closed Frame

Through Hole

Gold

Beryllium Copper

Wire Wrap

30 Áin

0.76 Ám

0.1 in

2.54 mm

30 µin

0.76 µm

2.54 mm

0.1 in

UL94 V-0

1 A

-55 °C

125 °C

15.24 mm

DIP

0.6 in

DIP

15.24 mm

0.62 in

15.75 mm

Part	Contact Material - Post	Housing Material	Contact Resistance	Contact Finish - Mating	Features	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Contact Finish - Post	Contact Material - Mating	Termination	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Type	Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Convert To (Adapter End)	Convert From (Adapter End)	Contact Finish Thickness - Post
3M 240-5205-01	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-00-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled	15 mOhm	Gold	Closed Frame	Connector	20		2	DIP, ZIF (ZIP)	Gold	Beryllium Copper	Press-Fit	0.11 in	2.78 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in	15.24 mm	0.6 "	UL94 V-0	40	1 A	-55 °C	125 °C
3M 240-1280-29-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "	0.62 in	15.75 mm	25.4 mm	1 in
3M 240-5205-00	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold		Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm		30 Áin	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "			25.4 mm	1 in	0.76 Ám
3M 240-1280-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm	0.62 in	15.75 mm

240-1280-00-0602J

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240-1280-00-0602J

Deep-Dive with AI

Pricing

Description

240 Series

Documents

Datasheet

Technical Data Sheet EN

Technical Specifications

240 Series