240 Series

Manufacturer: 3M

Catalog

IC & COMPONENT SOCKET, 40 CONTACTS, QFN TEST SOCKET, 0.5 MM, 240 SERIES, BERYLLIUM COPPER

Part	Contact Material - Post	Housing Material	Contact Resistance	Contact Finish - Mating	Features	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Contact Finish - Post	Contact Material - Mating	Termination	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Type	Type	Material Flammability Rating	Number of Positions or Pins (Grid)	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Number of Pins	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Termination Post Length [x]	Termination Post Length [x]	Convert To (Adapter End)	Convert From (Adapter End)	Contact Finish Thickness - Post
3M 240-5205-01	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-00-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled	15 mOhm	Gold	Closed Frame	Connector	20		2	DIP, ZIF (ZIP)	Gold	Beryllium Copper	Press-Fit	0.11 in	2.78 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in	15.24 mm	0.6 "	UL94 V-0	40	1 A	-55 °C	125 °C
3M 240-1280-29-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "	0.62 in	15.75 mm	25.4 mm	1 in
3M 240-5205-00	Beryllium Copper	Polyethersulfone (PES)	25 mOhm	Gold	Closed Frame	Through Hole	10	40	4	QFN	Gold	Beryllium Copper	Solder	0.118 in	3 mm
3M 240-1280-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold		Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm
3M 240-3639-09-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Solder	0.13 in	3.3 mm	30 Áin	0.76 Ám	0.1 in	2.54 mm		30 Áin	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C		DIP	25.4 mm	40		DIP	1 "			25.4 mm	1 in	0.76 Ám
3M 240-1280-19-0602J	Beryllium Copper	Polysulfone (PSU), Glass Filled		Gold	Closed Frame	Through Hole					Gold	Beryllium Copper	Wire Wrap			30 Áin	0.76 Ám	0.1 in	2.54 mm	30 µin	0.76 µm	2.54 mm	0.1 in			UL94 V-0		1 A	-55 °C	125 °C	15.24 mm	DIP	0.6 in	40	0.6 in	DIP	15.24 mm	0.62 in	15.75 mm