WAVE-23-125

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Active

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Description

General part information

Heat Sink BGA Aluminum Alloy Board Level

Parameters and characteristics for this part

Part	Width	Shape	Material	Attachment Method	Material Finish	Fin Height	Type	Package Cooled	Length	Thermal Resistance
Wakefield Thermal Solutions WAVE-23-165	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.65 in	Board Level	BGA	0.906 in	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.492 in	Board Level	BGA	0.906 in	6.76 °C/W
Wakefield Thermal Solutions WAVE-23-165	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.65 in	Board Level	BGA	0.906 in	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.492 in	Board Level	BGA	0.906 in	6.76 °C/W

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3D models and CAD resources for this part

Technical documentation and resources