WAVE-23 Series

Catalog

LOW PROFILE HEAT SINK BGA CHIPSET ALUMINUM TOP MOUNT ROHS COMPLIANT: YES

Part	Width	Shape	Material	Attachment Method	Material Finish	Fin Height	Type	Package Cooled	Length	Thermal Resistance
Wakefield Thermal Solutions WAVE-23-165	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.65 in	Board Level	BGA	0.906 in	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.492 in	Board Level	BGA	0.906 in	6.76 °C/W
Wakefield Thermal Solutions WAVE-23-165	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.65 in	Board Level	BGA	0.906 in	5.08 °C/W
Wakefield Thermal Solutions WAVE-23-125	0.906 in	Angled Fins Square	Aluminum Alloy	Clip	Black Anodized	0.492 in	Board Level	BGA	0.906 in	6.76 °C/W