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MSP430FR5870IRGCR

MSP430FR5870IRGCR

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Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 2KB SRAM, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR5870IRGCR

MSP430FR5870IRGCR

Active
Texas Instruments

16 MHZ MCU WITH 32KB FRAM, 2KB SRAM, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR5870 Series

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5870IRGCR
A/D Channels8 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O51
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package / Case64-VFQFN Exposed Pad
Package Length9 mm
Package Name64-VQFN
Package Width9 mm
PeripheralsPWM, POR, Reset, WDT, Brown-out Detect, DMA
Program Memory Depth32 K
Program Memory Size32 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430FR58,59,68,69xx User Guide
MSP Code Protection Features
MSP430FR597x(1),MSP430FR592x(1) MSP430FR587x(1) Mixed‑Signal Microcontrollers datasheet (Rev. C)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
MSP430 MCUs Development Guide Book (Rev. A)
Designing With MSP430™ MCUs and Segment LCDs (Rev. A)
MSP430 System ESD Troubleshooting Guide
FRAM FAQs
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
ESD Diode Current Specification (Rev. B)
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
Capacitive Touch and MSP Microcontrollers (Rev. A)
System advantages of mixed signal integration
Benchmarking MCU power consumption for ultra-low-power applications
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
MSP430FR5870 Microcontroller Errata (Rev. U)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
MSP430 FRAM Quality and Reliability (Rev. A)
MSP430 System-Level ESD Considerations (Rev. B)
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)